cai88453626的博客

evolution of semiconductor packaging 半导体封装的演变。integrated circuit package types 集成电路封装类型。Dualln-line Package DIP 双列直插式封装。Pull-down resistor 下拉电阻。Vee 发射级电源电压。chip 芯片。lead 引脚。GND 接地引脚。

原文

原文:①A company’s aim is to frame the narrative in a favourable manner.②Any firm wants to be seen not as a money-grubbing corporation that pollutes the environment and exploits its workers but as an innovative pionner with sustainable operations and a social