[linux thermal] thermal device tree

thermal device tree

本文kernel版本：4.14
由于各个厂商在thermal governor和硬件上的差异（sensor的排布不同），thermal zone中的温度sensor、cooling devices的设备树配置也有所不同。kernel document总结了几种thermal zone设备树配置示例。

1、cpu thermal zone

thermal zone包含一个温度sensor和若干cooling devices的情况

#include <dt-bindings/thermal/thermal.h>

/*cpufreq cooling device-passive被动冷却*/
cpus {
	/*
	 * Here is an example of describing a cooling device for a DVFS
	 * capable CPU. The CPU node describes its four OPPs.
	 * The cooling states possible are 0..3, and they are
	 * used as OPP indexes. The minimum cooling state is 0, which means
	 * all four OPPs can be available to the system. The maximum
	 * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V)
	 * can be available in the system.
	 */
    /*  */
	cpu0: cpu@0 {
		...
		operating-points = <
			/* kHz    uV */
			970000  1200000
			792000  1100000
			396000  950000
			198000  850000
		>;
		cooling-min-level = <0>;/* 说明四组OPPs都可用 */
		cooling-max-level = <3>;/* 说明OPPs中只有频率最低的那一组可用（198MHz@0.85V） */
		#cooling-cells = <2>; /* min followed by max */
	};
	...
};

/*风扇控制器-active主动冷却*/
/*一个通过i2c总线1控制的风扇设备fan0，地址0x48，有10个冷却等级*/
&i2c1 {
	...
	/*
	 * A simple fan controller which supports 10 speeds of operation
	 * (represented as 0-9).
	 */
	fan0: fan@0x48 {
		...
		cooling-min-level = <0>;
		cooling-max-level = <9>;/* 10 cooling states */
		#cooling-cells = <2>; /* min followed by max */
	};
};

/*温度传感器IC*/
/*ADC sensor（bandgap0），地址0x0000ED00，用来监视'cpu-thermal'的温度*/
ocp {
	...
	/*
	 * A simple IC with a single bandgap temperature sensor.
	 */
	bandgap0: bandgap@0x0000ED00 {
		...
		#thermal-sensor-cells = <0>;
	};
};

thermal-zones {
	cpu_thermal: cpu-thermal {
		polling-delay-passive = <250>; /* milliseconds */
		polling-delay = <1000>; /* milliseconds */

		thermal-sensors = <&bandgap0>;

		trips {
			cpu_alert0: cpu-alert0 {
				temperature = <90000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "active";
			};
			cpu_alert1: cpu-alert1 {
				temperature = <100000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "passive";
			};
			cpu_crit: cpu-crit {
				temperature = <125000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "critical";
			};
		};

		cooling-maps {
			map0 {
				trip = <&cpu_alert0>;
				cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;/* 温度超过cpu_alert0时，等级0-4 */
			};
			map1 {
				trip = <&cpu_alert1>;
				cooling-device = <&fan0 5 THERMAL_NO_LIMIT>;/* 温度超过cpu_alert1时，等级5-9 */ 
			};
			map2 {
				trip = <&cpu_alert1>;
				cooling-device =
				    <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;/* 所有冷却等级都可以用在cpu_alert1上，即温度在alert1-alert2之间，所有冷却等级可用 */
			};
		};
	};
};

2、IC with several internal sensors

每个sensor对应一个thermal zone的情况。
硬件排布上，这三个sensor分别放置在芯片中的不同位置，可以监视不同的热点温度。
bandgap0监视CPU thermal zone; bandgap1监视GPU thermal zone; bandgap2监视DSP thermal zone。
它们有各自的延时、trips和cooling maps。

#include <dt-bindings/thermal/thermal.h>

ocp {
	...
	/*
	 * A simple IC with several bandgap temperature sensors.
	 */
	bandgap0: bandgap@0x0000ED00 {
		...
		#thermal-sensor-cells = <1>;
	};
};

thermal-zones {
	cpu_thermal: cpu-thermal {
		polling-delay-passive = <250>; /* milliseconds */
		polling-delay = <1000>; /* milliseconds */

				/* sensor       ID */
		thermal-sensors = <&bandgap0     0>;

		trips {
			/* each zone within the SoC may have its own trips */
			cpu_alert: cpu-alert {
				temperature = <100000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "passive";
			};
			cpu_crit: cpu-crit {
				temperature = <125000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "critical";
			};
		};

		cooling-maps {
			/* each zone within the SoC may have its own cooling */
			...
		};
	};

	gpu_thermal: gpu-thermal {
		polling-delay-passive = <120>; /* milliseconds */
		polling-delay = <1000>; /* milliseconds */

				/* sensor       ID */
		thermal-sensors = <&bandgap0     1>;

		trips {
			/* each zone within the SoC may have its own trips */
			gpu_alert: gpu-alert {
				temperature = <90000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "passive";
			};
			gpu_crit: gpu-crit {
				temperature = <105000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "critical";
			};
		};

		cooling-maps {
			/* each zone within the SoC may have its own cooling */
			...
		};
	};

	dsp_thermal: dsp-thermal {
		polling-delay-passive = <50>; /* milliseconds */
		polling-delay = <1000>; /* milliseconds */

				/* sensor       ID */
		thermal-sensors = <&bandgap0     2>;

		trips {
			/* each zone within the SoC may have its own trips */
			dsp_alert: dsp-alert {
				temperature = <90000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "passive";
			};
			dsp_crit: gpu-crit {
				temperature = <135000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "critical";
			};
		};

		cooling-maps {
			/* each zone within the SoC may have its own cooling */
			...
		};
	};
};

3、Several sensors within one single thermal zone

一个thermal zone对应多个sensor的情况。
假设这里有两个sensor，一个在cpu内部，一个在靠近cpu的位置。该thermal zone的温度变化由这两个sensor共同决定。

#include <dt-bindings/thermal/thermal.h>

&i2c1 {
	...
	/*
	 * A simple IC with a single temperature sensor.
	 */
	adc: sensor@0x49 {
		...
		#thermal-sensor-cells = <0>;
	};
};

ocp {
	...
	/*
	 * A simple IC with a single bandgap temperature sensor.
	 */
	bandgap0: bandgap@0x0000ED00 {
		...
		#thermal-sensor-cells = <0>;
	};
};

thermal-zones {
	cpu_thermal: cpu-thermal {
		polling-delay-passive = <250>; /* milliseconds */
		polling-delay = <1000>; /* milliseconds */

		thermal-sensors = <&bandgap0>,	/* cpu */
				  <&adc>;	/* pcb north */

		/* hotspot = 100 * bandgap - 120 * adc + 484 */
		coefficients =		<100	-120	484>;

		trips {
			...
		};

		cooling-maps {
			...
		};
	};
};

4、board thermal

一个thermal zone有多个sensor和cooling device的情况。
电池的thermal zone对应sensor adc_dummy4
board的thermal zone对应sensor adc_dummy0、1、2

#include <dt-bindings/thermal/thermal.h>

&i2c1 {
	...
	/*
	 * An IC with several temperature sensor.
	 */
	adc_dummy: sensor@0x50 {
		...
		#thermal-sensor-cells = <1>; /* sensor internal ID */
	};
};

thermal-zones {
	batt-thermal {
		polling-delay-passive = <500>; /* milliseconds */
		polling-delay = <2500>; /* milliseconds */

				/* sensor       ID */
		thermal-sensors = <&adc_dummy     4>;

		trips {
			...
		};

		cooling-maps {
			...
		};
	};

	board_thermal: board-thermal {
		polling-delay-passive = <1000>; /* milliseconds */
		polling-delay = <2500>; /* milliseconds */

				/* sensor       ID */
		thermal-sensors = <&adc_dummy     0>, /* pcb top edge */
				  <&adc_dummy     1>, /* lcd */
				  <&adc_dummy     2>; /* back cover */
		/*
         * 三个sensor的线性对应关系：
		 * An array of coefficients describing the sensor
		 * linear relation. E.g.:
		 * z = c1*x1 + c2*x2 + c3*x3
		 */
		coefficients =		<1200	-345	890>;

		sustainable-power = <2500>;

		trips {
			/* Trips are based on resulting linear equation */
			cpu_trip: cpu-trip {
				temperature = <60000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "passive";
			};
			gpu_trip: gpu-trip {
				temperature = <55000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "passive";
			}
			lcd_trip: lcp-trip {
				temperature = <53000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "passive";
			};
			crit_trip: crit-trip {
				temperature = <68000>; /* millicelsius */
				hysteresis = <2000>; /* millicelsius */
				type = "critical";
			};
		};

		cooling-maps {
			map0 {
				trip = <&cpu_trip>;
				cooling-device = <&cpu0 0 2>;
				contribution = <55>;
			};
			map1 {
				trip = <&gpu_trip>;
				cooling-device = <&gpu0 0 2>;
				contribution = <20>;
			};
			map2 {
				trip = <&lcd_trip>;
				cooling-device = <&lcd0 5 10>;
				contribution = <15>;
			};
		};
	};
};

参考链接：https://elixir.bootlin.com/linux/v4.14.262/source/Documentation/devicetree/bindings/thermal/thermal.txt