Samsung Semiconductor Part Number
First 2 codes of Part Number | Semiconductor Name |
K1 | UtRAM |
K4 | DRAM |
K6 | AsyncFastSRAM |
K7 | SyncSRAM |
K8 | NORFlash |
K9 | NANDFlash |
KF | OneNAND |
KM | MOVINAND/MCP |
M3 | DIMM |
MR | RIMM |
S3 | Microcontroller |
S5 | MOS |
S6 | DDI |
S8 | CDRAM |
详细参考:
http://www.samsung.com/global/business/semiconductor/products/fusionmemory/Products_MoviNAND.html
Sample:
魅族M8的Rom的Part Number为KMCMG0000M-B998,分析如下:
K M X X X X X X X X - X X X X X X X
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
1. Memory (K)
2. MOVI NAND/MCP : M
3. Small Classification
A : NAND + MCU
B : NAND + NAND + MCU
C : NAND + NAND + NAND + NAND + MCU
D : NAND + NAND + NAND + MCU
H : NAND + NAND + NAND + NAND + NAND +
NAND + NAND + NAND + MCU
X : moviNAND + NAND + SDRAM
Y : moviNAND + OneNAND + SDRAM
Z : moviNAND + NAND + SDRAM + SDRAM
4. MoviNAND Density & Vcc & Org. & BB
5. LSI
A : S3C49RAX01 D : S3C49NBX01
E : S3C49VCX01 F : S3C49VCX02
G : S3C49VCX03 N : S3C49VAX03
10. Generation
M : 1st Generation A : 2nd Generation
B : 3rd Generation C : 4th Generation
11. "─"
12. Package
A : FBGA (Halogen-Free, Lead-Free)
B : FBGA (Halogen-Free, OSP Lead-Free)
D : FBGA (Lead-Free) E : LGA (NO Ball)
F : FBGA H : LGA (Lead-Free)
P : FBGA (OSP) Q : TSOP (Lead-Free)
S : FBGA (OSP Lead-Free)
Y : FBGA (MoviNAND Special 2)
Z : FBGA (MoviNAND Special 1)
13~15. Serial Number
(13) Chip Qty
1 : 1chip 2 : 2chip
3 : 3chip 4 : 4chip
5 : 5chip 6 : 6chip
(14)~(15) Serial Number
300 : 19ns, 12ns, 7.5ns
301 : 19ns, 42ns, 7.5ns
302 : 19ns, 12ns, 6ns
400 : 19ns(2), 42ns, 7.5ns
401 : 19ns, 42ns, 6ns, 6ns
402 : 19ns(2), 42ns, 6ns
403 : 19ns(2), 12ns, 6ns
500 : 19ns(2), 42ns, 6ns, 6ns
501 : 19ns(2), 42ns, 7ns, 6ns
600 : 19ns(4), 42ns, 7.5ns
601 : 19ns(4), 42ns, 6ns
700 : 19ns, 42ns, 7.5ns, 7.5ns
701 : 19ns(4), 42ns, 6ns, 6ns
998 : moviNAND Normal
999 : Daisychain Sample