Samsung Semiconductor Part Number

 Samsung Semiconductor Part Number

First 2 codes of Part Number	Semiconductor Name
K1	UtRAM
K4	DRAM
K6	AsyncFastSRAM
K7	SyncSRAM
K8	NORFlash
K9	NANDFlash
KF	OneNAND
KM	MOVINAND/MCP
M3	DIMM
MR	RIMM
S3	Microcontroller
S5	MOS
S6	DDI
S8	CDRAM

详细参考：

http://www.samsung.com/global/business/semiconductor/products/fusionmemory/Products_MoviNAND.html

Sample：

魅族M8的Rom的Part Number为KMCMG0000M-B998，分析如下：

K M X X X X X X X X - X X X X X X X

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

1. Memory (K)

2. MOVI NAND/MCP : M

3. Small Classification

A : NAND + MCU

B : NAND + NAND + MCU

C : NAND + NAND + NAND + NAND + MCU

D : NAND + NAND + NAND + MCU

H : NAND + NAND + NAND + NAND + NAND +

NAND + NAND + NAND + MCU

X : moviNAND + NAND + SDRAM

Y : moviNAND + OneNAND + SDRAM

Z : moviNAND + NAND + SDRAM + SDRAM

4. MoviNAND Density & Vcc & Org. & BB

 

 

5. LSI

A : S3C49RAX01 D : S3C49NBX01

E : S3C49VCX01 F : S3C49VCX02

G : S3C49VCX03 N : S3C49VAX03

10. Generation

M : 1st Generation A : 2nd Generation

B : 3rd Generation C : 4th Generation

11. "─"

12. Package

A : FBGA (Halogen-Free, Lead-Free)

B : FBGA (Halogen-Free, OSP Lead-Free)

D : FBGA (Lead-Free) E : LGA (NO Ball)

F : FBGA H : LGA (Lead-Free)

P : FBGA (OSP) Q : TSOP (Lead-Free)

S : FBGA (OSP Lead-Free)

Y : FBGA (MoviNAND Special 2)

Z : FBGA (MoviNAND Special 1)

13~15. Serial Number

(13) Chip Qty

1 : 1chip 2 : 2chip

3 : 3chip 4 : 4chip

5 : 5chip 6 : 6chip

(14)~(15) Serial Number

300 : 19ns, 12ns, 7.5ns

301 : 19ns, 42ns, 7.5ns

302 : 19ns, 12ns, 6ns

400 : 19ns(2), 42ns, 7.5ns

401 : 19ns, 42ns, 6ns, 6ns

402 : 19ns(2), 42ns, 6ns

403 : 19ns(2), 12ns, 6ns

500 : 19ns(2), 42ns, 6ns, 6ns

501 : 19ns(2), 42ns, 7ns, 6ns

600 : 19ns(4), 42ns, 7.5ns

601 : 19ns(4), 42ns, 6ns

700 : 19ns, 42ns, 7.5ns, 7.5ns

701 : 19ns(4), 42ns, 6ns, 6ns

998 : moviNAND Normal

999 : Daisychain Sample