【论文】 Characterization of compact heat sink models in natural convection

基本思想

The approach to be followed is based on the idea that a heat sink may be replaced by a volumetric fluid block that exhibits the same effective thermal conductivity and flow resistance values as those of the actual prototype.

前序方案中，已有使用局部流体块代替实际散热器的情况，也存在使用extended flat plate surface model for simulating natural convection cooling. 该方法采用流体块等效实际的Heat sink，而不是将实际热特性赋值the base plate. Furthermore, 该方法采用增加fluidic block的等效热导率，而不是通过增加base plate面积或对流系数的方式，达到相同的热量分布情况。
本文采用等效热传导系数U，包括了对流和热辐射的情况。

背景

现有的研究目标是 Heat sink的优化和选择，包括不同压力、不同使用场景下的fin优化等.

In a number of applications, arrays of micro-cooling devices become necessary to achieve the desired heat removal. Under such circumstances, detailed system-level modeling using CFD can become so demanding in terms of computing time and memory allocation.

Evidently, comparisons between detailed and compact simulations become crucial in the verification of the compact model.

仿真环境

3.1 Extruded-Fin Heat Sink

The extruded-fin heat sink consists of five fins mounted on a base. The base is supplied with 8 W of power stemming from an external source such as a micro-chip that is centered underneath the base.

1. Step 1: calculating the thermal resistance $\Theta$

$$\Theta = \frac{T_{max}-T_{\infty}}{Q}$$
在仿真中，需要保证compact模型的热阻 $\Theta$与模型一致，其中