多层PCB via stub效应（1）

背景介绍

背景主要包括了 多层PCB的优势，以及引出其中stub和带状线的问题；接下来解释了via stub所带来的问题，resonance effect；然后介绍了部分文献所提供的一些模型和考虑的方面；最后介绍了本文的侧重点，即通过时域仿真和测量来描述via stub的谐振效应，并给出了综合考虑信号过孔和地过孔的原因，即这种方法能够形成较好的wave guided properties，并且能够产生low radiation losses。

A multilayer printed circuit board is a type of low-cost interconnect structure which commonly includes through via holes and striplines.

Resonance effects due to a stub in a transition from a through via hole to a stripline in multilayer PCBs can significantly worsen electric performance of the transition at higher frequencies.

In particular, it was indicated on this effect in 1 where differential via holes were considered and effectively modeled as a cascade of capacitances and inductances.

In this letter, we present a study of the resonance stub effect in via structures including ground vias embedded in a multilayer PCB by a three-dimensional electromagnetic field simlator based on the time-domain analysis and measurements at frequencies up to 20 GHz.

Via stub的结构

这里研究两种stub结构，如下图所示，左图为stub输出在第10层金属上，有图为stub输出在第3层金属上。整体结构为12层金属，图中参数包括$H=2.4mm$，介质参数为$\epsilon=3.8$，金属设置为理想导体。

However, being different in their lengths calls for the establishment of the resonance in the transitions at different frequencies (for the longer stub, the resonance will be shifted to the lower frequencies.)

图1. 两种不同的via stub结构

如图2所示，采用地过孔产生回流路径，保证电流连续，地过孔与信号的距离为$l$。（”this via configuration corresponds to a cell of a high-density via structure under a large-scale integration chip.”）信号过孔焊盘直径$d_{pad}=0.5mm$，焊盘厚度 tpad=0.055mm