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Solder Paste for Mini LED Package
Mini LED is a new type of display technology that uses 50-200 micron LED chips as backlight or pixel units, achieving excellent display effects such as high brightness, high contrast and high colour gamut, etc. The chip package process of Mini LED mainly a原创 2024-05-07 10:54:26 · 691 阅读 · 0 评论 -
Pillow-Head Effect in BGA and CSP packages
With the BGA, CSP package devices to dense pitch, miniaturisation of the direction of development, the widespread application of lead-free processes to the electronic assembly process has brought new challenges. Pillow-head effect defects are BGA, CSP devi原创 2024-04-10 10:30:16 · 250 阅读 · 0 评论