The role of flux in reflow welding process

In the reflow welding process described in Figures 1 and 2, the role of flux and its relationship to the quality of the weld are critical. As a common connection technology in electronic manufacturing, reflow welding directly affects the reliability and stability of electronic products. The following is a detailed analysis of this process and the importance of nitrogen atmosphere welding.

The role of flux

The microstructure of the solder joint directly affects the mechanical and electrical properties of the solder joint, which mainly depends on the composition of the solder, melting and solidification process, interface reaction and aging conditions. FIG. 2 shows SEM photos of solder joints aged at 85°C. The Cu6Sn5 IMC layer is formed after reflow welding. In SnBi57.6Ag4 solder, there are Ag3Sn particles less than 1μm, and when 1%Ag is added to SnBi solder, large Ag3Sn IMC is formed on Cu6Sn5 layer.

Figure 1. The role of flux in reflow welding process

The importance of nitrogen atmosphere welding

1. Prevent oxidation: Nitrogen is an inert gas that will not chemically react with the metal to be welded, so it can effectively isolate oxygen in the air and prevent oxidation of the metal at high temperatures. This is of great significance for improving welding quality and reducing welding defects.

2. Improve welding quality: The use of nitrogen atmosphere welding can significantly reduce the phenomenon of cold welding, incomplete pad coverage, and non-melting tin in the welding process. At the same time, nitrogen can also help reduce the temperature gradient in the welding process, reduce the influence of thermal stress on the solder joint, and improve the reliability and stability of the solder joint.

3. Adapt to the needs of lead-free process: With the improvement of environmental awareness and regulations, lead-free welding process has gradually become the mainstream. However, the melting point of lead-free solder is higher, and the preheating temperature and welding peak temperature are correspondingly increased, which makes the welded metal more oxidized. The use of nitrogen atmosphere welding can be a good solution to this problem to ensure the stability and reliability of lead-free welding process.

FIG. 2 Performance of insufficient function of flux to prevent reoxidation

Flux plays an important role in reflow welding process, and its functions of cleaning, wetting and preventing reoxidation directly affect welding quality. As an effective protective measure, nitrogen atmosphere welding can significantly improve welding quality, reduce welding defects, and adapt to the needs of lead-free technology. Therefore, when selecting and using the flux, it is necessary to make comprehensive consideration according to the specific welding process and requirements to ensure the quality and reliability of the welded joint. In the microelectronics and semiconductor packaging process, the reflux process of ultra-fine solder paste must be protected by nitrogen. The reduction of the particle size of the metal powder in the ultra-fine solder paste is particularly important to prevent oxidation of the flux during the heating process. The oxygen concentration of the nitrogen atmosphere is very important.返