英文名称缩写 | 英文名称 | 中文名称 |
SK-DIP | Skinny DIP | 膜状DIP |
SL-DIP | Slim DIP | 细长DIP |
SH-DIP | Shrink DIP | 收缩DIP |
DIP | Dual inline package | 双列直插式封装 |
ZIP | Zigzag inline package | 直插式封装 |
SZIP | Shrink ZIP | 缩小的ZIP |
PGA | Pin grid array | 针栅阵列或柱形封装 |
HPGA | PGA with heatsink | 散热的PGA |
SPGA | Shrink PGA | 缩小的PGA |
QFJ | Quad flat j-leaded package | 四边扁平封装,引脚为“J”形 |
QFP | Quad flat package | 四边扁平封装 |
HQFP | QFP with heatsink | 散热的QFP |
SQFP | Shrink QFP | 缩小的QFP |
TPQFP | QFP with test pad |
|
QTP | Quad tape carrier package |
|
UTQFP | Ultra thin QFP |
|
CQFP |
| 陶瓷四边扁平封装 |
PQFF |
| 塑料四边扁平封装 |
MQFF |
| 金属四边扁平封装 |
SOP | Small outline package | 小外形封装,引脚为翼形“L”形 |
MSOP | SOP with heatsink | 散热的SOP |
SOJ | Small outline j-leaded package | 小外形封装,引脚为“J”型 |
SSOP | Shrink SOP | 缩小的SOP |
TSOP | Thin SOP |
|
DTP | Dual tape carrier package |
|
SVP | Surface wertical package |
|
UTSOP | Ultra thin SOP | 非常瘦的SOP |
SON | Small outline non-lead | 无铅的小外形封装 |
QFN | Quad flat non-lead | 无铅的西边扁平封装 |
BGA | Ball grid array | 球栅阵列封装 |
PGA | Pin grid array package | 插针网格阵列封装 |
CSP | Chip size package | 芯片尺寸封装 |
PICC |
| 有粗端引线 塑料芯片载体 |
USP | Ultra small package | 非常小的封装 |
3DPM | 3 dimentional package module |
|
3D-SON | 3DPM-son |
|
3D-SVP | 3DPM-svp |
|
3D-DIP | 3DPM-dip |
|
MCM | Multi chip model | 多芯片组件 |
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