高通热力系统设计综述

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Thermal Systems Design Review

80-P1834-1 A

Contents(目录)

  1. Purpose(目的)
  2. Overview(简介)
  3. Data for the OEM Thermal Information Spreadsheet(OEM热信息电子表格的数据
  4. Files to be Uploaded to the Salesforce Case(要上载到Salesforce案例的文件
  5. References(参考文献)
  6. Questions?(仍有问题?)

Purpose(目的

  • Thermal systems design review:
    热力系统设计评审:
    • Enables OEMs to receive feedback on thermal software settings, custom thermal configuration, and overall hardware thermal performance
      使OEM能够接收有关散热软件设置、自定义散热配置和整体硬件散热性能的反馈
    • Helps OEMs avoid pitfalls of thermal systems configuration and tuning
      帮助OEM避免热力系统配置和调整中可能的陷阱
    • Opens communication so OEMs can achieve optimal thermal performance for a target platform
      开放通信,使OEM能够为目标平台实现最佳的散热性能

Overview(概论)

  • Open the Thermal Systems Design Review case in Salesforce
    在Salesforce中打开热力系统设计审查案例
  • Provide data in the OEM Thermal Information spreadsheet (attached)
    在OEM散热信息电子表格中提供数据(附件)
    • Power thermal envelope (leave this worksheet blank)
      功率热包络(此项留白)(此项定义不明
    • Skin temperature specification
      表面温度规格
    • Thermal sensor for skin temperature mitigation
      用于降低表面温度的热传感器
    • Performance requirements (if performance has priority over thermal)
      性能要求(如果性能优先于散热)
  • Upload files to the Thermal Systems Design Review case:
    将文件上传到热系统设计审查案例:
    • Completed OEM Thermal Information spreadsheet
      填写好的OEM热信息电子表格
    • Embedded thermal engine defaults (ss-data.c, thermal_monitor-data.c)
      嵌入式热机默认设置 (ss-data.c, thermal_monitor-data.c)
    • Custom OEM thermal configuration (thermal-engine.conf)
      自定义OEM热配置(Theratio-Engine.conf)
    • OEM Kernel Thermal Monitor (KTM) settings (msmXXXX.dtsi)
      OEM内核温度监视器(KTM)设置(msmXXXX.dtsi)
    • Antutu 5.6 64-bit score breakdown (xml file)
      Antutu
      5.6 64位分数细分(XML文件) 64bit精度?

Data for the OEM Thermal Information Spreadsheet

OEM热信息电子表格的数据

  • Power thermal envelope
    功率热包络(耗能?)
    • Amount of power that can be consumed while sustaining skin temperature at
      the OEM skin temperature specification (for example, 4 W at 45 °C)
      在OEM皮肤温度规格(例如,45°C时为4 W)下保持皮肤温度时可以消耗的电量
    • This worksheet should remain blank for the time being
      此工作表应暂时保留为空
    • A solution that enables OEMs to gather this information is in progress
      使原始设备制造商能够收集这些信息的解决方案正在开发中
  • Skin temperature specification
    皮肤温度规格
    • Value of the temperature that the external case temperature must remain under
      for end-user comfort and safety
      为了最终用户的舒适性和安全性,外壳温度必须保持在以下的温度值
    • Determined by OEM and in some cases government agency and/or carrier
      requirement
      由OEM决定,在某些情况下还取决于政府机构和/或承运人的要求
    • Determines where the thermal configuration rules must be set for skin
      temperature management
      确定必须在何处设置皮肤温度管理的热配置规则
  • Thermal sensor used for skin temperature mitigation
    用于降低皮肤温度的热力传感器
    • Name of the sensor that the OEM intends to use for skin temperature management
      OEM打算用于皮肤温度管理的传感器名称
    • If no sensor as been selected, list none
      如果未选择传感器,请列出无
  • Performance requirements
    性能要求
    • Only required for use cases in which performance has priority over thermal(e.g., Antutu score or fps during camcorder)
      仅在性能优先于散热的使用情况下才需要(例如,摄像机期间的安兔兔评分或fps)
    • List the use cases and the performance requirement
      列出使用情形和性能要求

Files to be Uploaded to the Salesforce Case

要上载到Salesforce案例的文件

OEM Thermal Systems Software Questionnaire

OEM热系统软件调查问卷

  • Confirms thermal software settings
    确认散热软件设置

  • Complete the following information in the OEM Thermal Information spreadsheet (attached):
    在OEM热信息电子表格中填入下列信息(随附件):
    • Power thermal envelope measurement
      功率热包络测量
    • Skin temperature specification
      皮肤温度规格
    • Thermal sensor used for skin temperature mitigation
      用于降低皮肤温度的热传感器
    • Performance requirements (if applicable)
      性能要求(如果适用)
    • Thermal software questionnaire
      热软件问卷调查

Embedded Thermal-engine Defaults

嵌入式热机默认值

  • Embedded thermal defaults contain QTI-recommended settings for junction temperature management and other settings for overall system stability during extreme hot and cold conditions
    嵌入式热默认值包含用于结点温度管理的QTI推荐设置,以及在极端炎热和寒冷条件下确保系统整体稳定性的其他设置
  • QTI does not recommend changing the embedded source code rules
    QTI不推荐改变嵌入式源代码规则
  • If a source code change has been made, QTI can identify any added risk or concern
    如果源码已经被改变,QTI可以识别任何额外的风险或担忧
  • Source code files containing the settings:
    包含设置的源代码文件:
    • /vendor/qcom/proprietary/thermal-engine/ss-data.c
    • /vendor/qcom/proprietary/thermal-engine/thermal_monitor-data.c

Custom OEM Thermal Configuration

自定义OEM散热配置

  • OEMs add custom thermal configuration rules for skin temperature management and to meet OEM performance requirements
    OEM添加用于皮肤温度管理并满足OEM性能要求的自定义的热配置规则
  • OEMS add the rules to thermal-engine.conf and place the file in the device file system (i.e., /system/etc/thermalengine.conf)
    OEM在thermal-engine.conf中添加规则并将这个文件放到设备文件系统中(例如,/system/etc/thermalengine.conf)
  • QTI evaluates the custom OEM thermal configuration for accuracy and effectiveness
    QTI评估OEM自定义的散热配置的准确性和有效性
  • To provide the configuration file, run the following ADB command from the device file system:
    为了获得配置文件,在设备的文件系统中执行下面的ADB指令
    • adb pull /system/etc/thermal-engine.conf <local_directory_on_PC>

OEM Kernel Thermal Monitor (KTM) Settings

OEM内核温度监视器(KTM)设置

  • KTM settings contain emergency mitigation rules that are not intended for change
    内核温度监视器(KTM)包含了不建议更改的紧急缓解规则(高温时降频这些?
    • Changing these settings can add stability risk and impact performance
      改变这些设置会增加稳定性风险并影响性能
    • If a change has been made, QTI can identify any added risk or concerns
      如果进行了更改,QTI可以识别任何增加的风险或顾虑
  • Provide the following dtsi file from source code (XXXX corresponds to the dtsi file for your chipset, e.g., msm8994.dtsi):
    从源码中提供下面的dtsi文件(
    XXXX对应于您的芯片组的dtsi文件,例如msm8994.dtsi
    • /kernel/arch/arm/boot/dts/qcom/msmXXXX.dtsi

Antutu 5.6 64-bit Score Breakdown

安兔兔5.6 64位分数明细

  • Antutu score indicates how effectively heat is spreading away from MSM™
    安兔兔评分说明了热量从MSM™散开的有效程度
    • Low score might indicate hardware thermal issues
      分数低可能表示硬件过热问题
    • High score might point to an effective thermal mechanical design
      分数高可能表示一个有效的机械散热设计
  • Use the ADB command to collect the score breakdown:
    使用ADB指令来收集分数细分
    • adb pull /sdcard/.antutu/benchmark/history_scores/ <antutu_xml_file>

Questions?

仍有问题?

可以登录 Qualcomm CreatePoint获取更多资料或提问。

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