AD21 封装向导:
DIP:双列直插 dual in-line package
Edge Connectors(边沿连接)
LCC:Leadless Chip Carriers
PGA :(Pin Grid Array Package)
QUAD:
SOP:Small Out-Line Package小外形封装
SBGA:BGA超级球栅阵列,带散热器
SPGA:超级PGA
AD21 封装向导:
DIP:双列直插 dual in-line package
Edge Connectors(边沿连接)
LCC:Leadless Chip Carriers
PGA :(Pin Grid Array Package)
QUAD:
SOP:Small Out-Line Package小外形封装
SBGA:BGA超级球栅阵列,带散热器
SPGA:超级PGA