msl3等级烘烤时间_湿敏等级MSL Moisture sensitivity levels Classifications

最近发现每次回来翻看Jedec标准总是会有新收获，索性就写下来，供大家参考。水平有限还请见谅！另外，欢迎讨论！这次就讲讲湿敏等级(MSL)吧.

标准全文请见 J-STD-020E.

(1) Purpose:

identify the classification level of nonhermetic surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

开篇讲述了这份标准的目的，这非常重要，经常有人说MSL，但MSL是如何定义，这样定义的作用又是如何？目的：确定IC的湿敏等级，使之能够正确的被包装，储存或处理，从而避免在装配的回流焊时或者返修时候受到损坏。

(2) ‘popcorn' phenomenon:

The vapor pressure of moisture inside a nonhermetic package increases greatly when the package is exposed to the high temperature of solder reflow. Under certain conditions, this pressure can cause internal delamination of the packaging materials from the die and/or lead-frame/substrate, internal cracks that do not extend to the outside of the package, bond damage, wire necking, bond lifting, die lifting, thin film cracking, or cratering beneath the bonds. In the most severe case, the stress can result in external package cracks. This is commonly referred to as the‘popcorn’phenomenon because the internal stress causes the package to bulge and then crack with an audible ‘‘pop.’’

在大多数人的认知中，“popcorn”现象就是受热炸开了，但要用文字来详细描述这个过程就不是那么容易，这份标准中的描述很好。重要的是，上面这种描述体现了由内而外，扩大的过程。

(3) Procedure:

Sample preparation---Initial electrical test---Initial inspection (OM+SAT) ---Bake---Moisture Soak---Reflow---Final inspection (OM+SAT) ---Final Test

下面挑其中几个步骤详细说明：

1.Sample preparation:

Reclassification (Qualified Package without Additional Reliability Testing): minimum sample of 22 units from two nonconsecutive assembly lots.

Classificatio