哑弹 图像处理检测_基于图像处理的晶圆表面缺陷检测

基于图像处理的晶圆表面缺陷检测

刘西锋

【期刊名称】

《通信电源技术》

【年

(

卷

),

期】

2016(033)005

【摘要】

With the continuous development of science and technology in

our

country,

the

feature

size

of

wafer

is

decreasing.The

decrease

of

feature

size

promoted

the

development

of

China's

integrated

circuit

manufacturing

technology

to

a

certain

extent.But

because

of

the

reducing

related

defects,

the

defect

of

the

wafer

surface

has

already

begun

to

affect

the

yield.This

article

s