VPX标准

1. VPX简介

VPX标准包括板卡尺寸、连接器种类和数量、信号类型及引脚号等内容。

1.1 特点

高密度、高速率、模块化、通用性电连接器

符合VITA46/48/65标准

端接方式:压配免焊

子板与母版垂直插接

传输信号:差分、单端、差分单端混合、电源等多种

1.2 常见应用

加固计算机、航电系统、火控雷达总线系统、航空及房屋系统、大容量数据储存

1.3 主要技术指标

差分阻抗:100Ω

串扰:100ps上升时间内线间串扰≥30dB

最高传输速率:10Gb/s

许用电压范围:0~50V

温度范围:-55℃~125℃

寿命:200次插拔循环

2. 连接方式

2.1 板卡布局

根据配备连接器数量,VPX板卡(子板)分为3U和6U两种标准尺寸,根据冷却方式,又分为空气冷却和导体冷却两种模块。故VPX板卡的形制可分为4种,即3U-空气冷却型、3U-导体冷却型、6U-空气冷却型和6U-导体冷却型。

对于3U和 6U模块 ,VITA46协议给出的PCB尺寸分别为160mmx100mm和160mmx233.35mm,各模块 之问的间距为20.32mm。在此要说明的是,在VITA48 协议即加固型VPX系统的实现中,增加 了0.85英寸(21.59mm)以及1英寸(25.4mm)的模块间距选项;在所用连接器符合 VITA46协议 的前提下,VPX系统模块允许采用其他的结构形式。

3U模块配备3个连接器,分别为P0、P1和P2,连接器之间紧密贴合;6U模块在3U的基础上增加了P3、P4、P5和P6连接器。3U配备2个导向销,6U配备3个导向销。

2.2 连接器组成

如上已述,VPX板卡(子板)上的连接器为P0~P2(3U)或P0~P6(6U),子板与母板对应插接,并用定位销固定,不用焊接即可实现子板与母板间的互联。

母板上的连接器为J0~J2(3U)、J0~J6(6U),与子板的P连接器对应相连,两板垂直插接。(图中J1实际应摆放到J0和J2中间,为方便看,放到下面)

常见的子板、母板连接器料号如下:

每个连接器由若干个不同种类的PCB板组成,如1410189-3型号的P0连接器,包含ABCD四种PCB板,以一定组合进行排列,用于传输不同种类信号。

该连接器与子板的连接方式如下,只是错位摆放便于看到焊盘:连接器下方的引脚焊接到焊盘中,突出的PCB板金手指凸出到子板边界外,用于插接母板。

3.3 引脚对应关系

子板和主板端连接器的引脚并非一一对应,P连接器的引脚数量少于J连接器,引脚对应关系如下

J0与P0

J1与P1

J2与P2

J3与P3

J4与P4

J5与P5

J6与P6

Abstract This standard describes VITA 46.0 Advanced Module Format for VMEbus systems, an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. Foreword VME has been the de-facto bus standard for Commercial off the Shelf ( COTS ) Circuit Card Assemblies since the 1980’s. VME boards have proven to be remarkably capable of evolving to support newer technologies with innovations such as VME Subsystem Bus, PCI Mezzanine Cards (PMC’s) and VME320. However, advances in technologies, appearing particularly in interconnects, have demonstrated the need for an advance in system development. This advance needs to accommodate high speed interconnect, particularly serial interconnects, and higher power delivery in concert with better heat removal. This draft standard addresses these needs in the context of IEEE 1101 form factor modules. Other specifications may address alternate outlines, such as VITA-48 (Draft). Because electronics miniaturization is driving the plug-in module I/O count, most system interconnects will need:  Multi-gigabit differential technology  Core computing cluster switched fabrics  Serial RapidIO, PCI Express, Advanced Switching Interconnect  Sufficient ports to enable distributed switching or centralized switching The plethora of high-speed interfaces available for tomorrow’s plug-in modules:  Network interfaces (Fibre Channel, 10 GbE XAUI, Infiniband…,)  Digital video (TMDS, PanelLink, OpenLDI…)  Mass storage interface (Fibre Channel, Serial ATA…,)  FPGA-based inter-board connections (e.g. Xilinx RocketIO)  Custom sensor interfaces VITA 46 provides an evolutionary roadmap for VME users:  To leverage the broad spectrum of high-speed interconnect technologies  Backward compatibility with VME bus electrical, software and selected mechanicals  Enables heterogeneous architectures which preserve existing investments in COTS-based systems  Addresses both 3U and 6U form factors with commonality  Harsh environment fit ‘designed-in’ up front in the standard  Rugged air or conduction-cooled form factors  High value placed on rear-panel I/O  High-speed connector survivability/compliance
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