TPS54331降压芯片的使用

要做一个12v转5v的降压电路,刚开始选用的LM7805,结果有同事和我说7805输出5v的电流很小,真的假的。

39bb2a0e747e47759fac0fafe6ca1755.jpg

 大家看这里,输出电压典型值5v,输出电流在5mA和1A之间,那给电路的功率就是5w,很也不算很小,不过看数据手册的时候我有个其他地方的困惑。大家看下面这个图:

5d4d393a7e244c748e38138e7138082a.jpg

 这个图代表环境温度从-75度升到125度时芯片的功耗变化。最上面那跟线是无限散热器的情况,中间的那跟是10C散热器的情况,最下面的那跟是不加散热器的情况。观察这三根线趋势,那就是温度升高时,芯片的功耗在减小,这个就让我很奇怪。温度升高,芯片工作电流增大,输出功耗不应该升高么,有看到的给说下原因么。很奇怪这地方,下面是芯片数据手册。

https://kdocs.cn/l/ccz6nhzDIbtR?f=201

[文件]2287578129LM7805A(1).pdf

可复制链接到WPS Office中打开文档

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The TPS54331 is a 28-V, 3-A non-synchronous buck Integrated 80 mΩ High Side MOSFET Supports up to 3A Continuous Output Current converter that integrates a low Rds(on) high side MOSFET. To increase efficiency at light loads, a pulse skipping Eco-mode™ feature is automatically High Efficiency at Light Loads with a Pulse activated. Furthermore, the 1 A shutdown supply Skipping Eco-mode™ current allows the device to be used in battery Fixed 570kHz Switching Frequency Typical 1A Shutdown Quiescent Current powered applications. Current mode control with internal slope compensation simplifies the external compensation calculations and reduces component Adjustable Slow Start Limits Inrush Currents count while allowing the use of ceramic output Programmable UVLO Threshold Overvoltage Transient Protection capacitors. A resistor divider programs the hysterisis of the input under-voltage lockout. An overvoltage transient protection circuit limits voltage overshoots Cycle by Cycle Current Limit, Frequency Fold during startup and transient conditions. A cycle by Back and Thermal Shutdown Protection cycle current limit scheme, frequency fold back and Available in Easy-to-Use SOIC8 Package Supported by SwitcherPro™ Software Tool (http://focus.ti.com/docs/toolsw/folders/print/s witcherpro.html) For SWIFT™ Documentation, See the TI Website at www.ti.com/swift thermal shutdown protect the device and the load in the event of an overload condition. The TPS54331 is available in an 8-pin SOIC package that has been internally optimized to improve thermal performance.

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