Standard specifications and applications of tin powder granules

Tin powder has a wide range of uses and is commonly used in powder metallurgy as an additive and porous material. Tin powder is also used as a high purity reagent in the electronics industry. The particle standard of tin powder is generally reflected by the particle size distribution, particle size, sphericity, chemical purity, surface finish, oxygen content and other indicators.

Specific indicators are reflected:

1, particle size range

According to the application requirements, the size range of tin powder particles can range from submicron to several hundred microns. For example, tin powder for welding generally requires a finer particle size to ensure good welding performance and uniform melting effect.

2、Morphology

The morphology of tin powder can be spherical, irregular shape or other specific shapes. Standard specifications may require the morphology of tin powder to meet specific application requirements.

3、Particle Size/Particle Size

Standards often specify methods of measuring particle size distribution and data presentation (e.g., cumulative distribution curves, frequency distribution curves) to ensure consistent performance from batch to batch of powder.

Fine tin powder particles have a larger surface area, making them more likely to react with oxygen in the air, resulting in a significant increase in oxygen content. Assuming the particles are spherical, the surface area A and volume V of a single particle are:

A=4πr2

V=34πr3

The total surface area per unit mass of powder is inversely proportional to the radius of the particles, r, i.e., a decrease in the radius of the particles increases the total surface area.

Tin powders are widely used in the electronics industry, and the common models of tin powders are No. 2 powder, No. 3 powder, No. 4 powder and No. 4 powder. Different models of tin powder play a vital role in the electronics industry by adjusting the particle diameter to suit different soldering needs. powder #2 and powder #3 are suitable for products with large solder joint spacing, while powder #4 and powder #5 are more suitable for high-density, miniaturized soldering scenarios.

When selecting tin powders, it is necessary to refer to the relevant standards and specifications according to the specific application needs and process requirements to ensure that the quality and performance of the powder meets the requirements. Fuyingda has global front-end technologies, such as liquid-phase molding solder powder manufacturing technology, which can manufacture T2-T10 full-size ultra-fine alloy solder powder, and is currently the world's only manufacturer of electronic-grade encapsulation materials that can manufacture full-size T2-T10 ultra-fine alloy solder powder. With the advantages of narrow particle size distribution, low oxygen content and high chemical purity, FUJINDA has been generally recognized by global SMT electronic chemicals, micro-optoelectronics and semiconductor packaging manufacturers, and has become the leading unit in the formulation of electronic industry standard for solder powders by the Ministry of Industry and Information Technology (MIIT). Welcome to visit Fitech official website and communicate with us!