基于 VITA57.4 标准的 8 路 500MSPS/1GSPS/1.25GSPS 采样率 14 位 AD 采集 FMC 子卡模块

板卡概述
FMC148 是一款基于 VITA57.4 标准的 JESD204B 接口 FMC 子卡模块,该模块可以实现 8 路 14-bit、500MSPS/1GSPS/1.25GSPS ADC 采集功能。该板卡 ADC 器件采用 ADI 公司的 AD9680 芯片,全 功率-3dB 模拟输入带宽可达 2GHz。该 ADC 与 FPGA 的主机接口通 过 16 通道的高速串行 GTX 收发器进行互联。 该板卡主要面向通信与无线基础设施、雷达、宽频带通信、毫米 波通信、自动测试设备等应用。
软件支持
可选集成板级软件开发包(BSP):
支持 Xilinx 开发板;
支持 Kintex UltraScale 等;
可根据需求提供定制化算法与系统集成:
应用范围
雷达与智能天线、无线基础设施;
宽带 RF 信号处理,信号发生器;
通信测试设备;
自动驾驶 RADAR;

 

技术指标
ADC 性能指标(AD9680):
板卡支持 4 片 ADC,共 8 路模拟信号采集;
采样率:500MSPS/1GSPS/1.25GSPS 可选配;
采集分辨率:14 位;
JESD204B(子类 1)编码数字输出;
1.65W 总功耗(1GSPS 采样率);
SNR; 65.3dBFS@1GHz,-1dBFS  amplitude
SFDR: 85dBFS@1GHz,-1dBFS amplitude
ENOB;10.8BIT(10MHz)
DNL:±0.5LSB,INL=±2.5LSB;
直流供电:1.25V、2.5V,3.3V;
噪声密度:-154dBFS/Hz;
无失码;
2GHz 模拟输入全功率带宽(-3dB);
ADC 内部基准电压源;
混合 JESD204B Lane 配置;
时钟与触发
高性能时钟发生器:HMC7044;
支持 100MHz LVDS 晶振,支持外时钟输入;
支持 1 路输入/输出触发信号,LVTTL(3.3V)电平标准;
支持同步输入/输出;
物理与电气特征
板卡尺寸:84.1 x 69mm;
典型功耗:6W;供电:+12V;
散热方式:自然风冷散热;
环境特征
工作温度:-40°~﹢85°C;
存储温度:-55°~﹢125°C;
工作湿度:5%~95%,非凝结;

 

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Abstract This standard describes VITA 46.0 Advanced Module Format for VMEbus systems, an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. Foreword VME has been the de-facto bus standard for Commercial off the Shelf ( COTS ) Circuit Card Assemblies since the 1980’s. VME boards have proven to be remarkably capable of evolving to support newer technologies with innovations such as VME Subsystem Bus, PCI Mezzanine Cards (PMC’s) and VME320. However, advances in technologies, appearing particularly in interconnects, have demonstrated the need for an advance in system development. This advance needs to accommodate high speed interconnect, particularly serial interconnects, and higher power delivery in concert with better heat removal. This draft standard addresses these needs in the context of IEEE 1101 form factor modules. Other specifications may address alternate outlines, such as VITA-48 (Draft). Because electronics miniaturization is driving the plug-in module I/O count, most system interconnects will need:  Multi-gigabit differential technology  Core computing cluster switched fabrics  Serial RapidIO, PCI Express, Advanced Switching Interconnect  Sufficient ports to enable distributed switching or centralized switching The plethora of high-speed interfaces available for tomorrow’s plug-in modules:  Network interfaces (Fibre Channel, 10 GbE XAUI, Infiniband…,)  Digital video (TMDS, PanelLink, OpenLDI…)  Mass storage interface (Fibre Channel, Serial ATA…,)  FPGA-based inter-board connections (e.g. Xilinx RocketIO)  Custom sensor interfaces VITA 46 provides an evolutionary roadmap for VME users:  To leverage the broad spectrum of high-speed interconnect technologies  Backward compatibility with VME bus electrical, software and selected mechanicals  Enables heterogeneous architectures which preserve existing investments in COTS-based systems  Addresses both 3U and 6U form factors with commonality  Harsh environment fit ‘designed-in’ up front in the standard  Rugged air or conduction-cooled form factors  High value placed on rear-panel I/O  High-speed connector survivability/compliance

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