WSS（wafer support system)晶圆承载系统

WSS（wafer support system)晶圆承载系统。

WSS晶圆承载系统提供了一个临时的键合解决方案，方案用于晶圆减薄工艺和减薄后工艺期间对晶圆的支撑。

The Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations.

这个方案是在真空环境下，通过在晶圆表面旋涂UV粘合剂，再进行UV固化的方式，实现玻璃与晶圆之间的临时键合。因为是真空环境，所以可以保证晶圆和玻璃之间不会产生气泡。

The  UV curable adhesive is spun on the wafer surface and is used as a bonding agent between the glass support substrate and the wafer. The mounting process is performed under vacuum ensuring that no bubbles are entrapped between the wafer and the support glass. Grinding stress to the wafer can be minimized because the UV-curable adhesive flows into and supports the topography of the circuit patterns on the front side of the wafer.

WSS这种均匀的支撑方式可以使得晶圆减薄后的最小厚度能够达到20微米，且在晶圆减薄后，玻璃载板可支持晶圆减薄后的任何工艺，如蚀刻、CMP（化学机械研磨）、金属沉积等，同时