半自动WSS(晶圆键合) 晶圆临时键合
晶圆尺寸:4’&6’&8’&12’
装卸方式:晶圆手动放置与取出。
涂层方法:自动旋涂
控制单元:基于PLC的控制,带有7'触摸屏。
涂胶方法:手动涂胶
Wafer Sizes : 4'& 6'& 8'
Load/unload Methods:Manually load and unload wafers.
Coating Method:Automatic spin coating
Control Unit:PLC based control with 7' touch screen.
Adhesive Dispensing Method: Dispensing adhesive manua