Applications Subsystem Firmware Processor Developer Processor DMA Controller
Bluetooth Subsystem Processor Subsystem Digital Baseband Bluetooth Radio
Audio Subsystem Qualcomm® Kalimba™ DSP *2 Subsystem Clocking Audio Engine
Host Interfaces Subsystem UART I²C / SPI FS PHY
PMU Subsystem SMPSs and LDOs Auxiliary ADC Li-ion Battery Charger
System Manager Firmware Processor
Boot Manager OTP Memory
PIO Controller Developer/QTIL Firmware
PCB design
35 μm thick (1 oz) copper lands are recommended
nonsolder mask defined (NSMD) lands (lands smaller tha