最新参数对比:8155/8255/8295参数对比
SoC Chipset Feature Comparison
Feature | SA8155P | SA8195P | SA8295P |
---|---|---|---|
Process | 7 nm | 7 nm | 5 nm |
Package | 23 mm × 23 mm × 2.26 mm FCBGA+HS | 15 mm × 20 mm × 1.90 mm FCBGA+HS | 25 mm × 25 mm × 2.25 mm FCBGA+HS |
BGA pitch | 0.7 mm | 0.4 mm | 0.6 mm |
AECQ | Grade 3 | Grade 3 | Grade 3 |
CPU | Qualcomm ® Kryo™ 485, 2 MB L3 1 x Gold prime core up to 2.419 GHz 3 x Gold cores up to 2.131 GHz 4 x Silver cores up to 1.785 GHz | Kryo 495, 4 MB L3 4 x Gold prime core up to 2.496 GHz 4 x Silver cores up to 1.766 GHz | Kryo 695, 8 MB L3 4 x Gold prime core up to 2.5 GHz 4 x Gold cores up to 2.05 GHz |
DMIPS | 105K | todo | 220K |
Memory | 4 × 16 LPDDR4X; up to 2092.8 MHz | 8 × 16 LPDDR4X; up to 2092.8 MHz | 8 × 16 LPDDR4X; up to 2092.8 MHz |
GPU | Qualcomm ® Adreno™ 640 | Adreno 680 | Adreno 695 |
AI/NSP | V66, 4 x Qualcomm ® Hexagon™ Vector eXtensions (Qualcomm ® Hexagon™ Vector eXtensions (HVX)), 1 x HCP, up to 1.459 GHz | V66, 4 x HVX, 1 x HCP, up to 1.459 GHz | V68, 4 x HVX, 2 x HMX, up to 1.4 GHz |
DPU | Adreno DPU 895, 24 MP, DSC v1.1, up to 530 MHz | Adreno DPU 899, 40 MP, DSCv1.1, up to 530 MHz | Adreno DPU 1199, 64 MP, DSC v1.2, up to 600 MHz |
Camera Processor | Qualcomm Spectra™ 380 ISP, 2.5 Gbps/lane, 40 Gbps total | Qualcomm Spectra 390, 2.5 Gbps/lane, 40 Gbps total | Qualcomm Spectra 395, 2.5 Gbps/lane, 40 Gbps total |
VPU | Adreno VPU 554, decode 4k120, encode 4k60, concurrent 4k60/4k30 decode/encode | Adreno VPU 554, decode 4k120, encode 4k60, concurrent 4k60/4k30 decode/encode | Adreno VPU 665, decode 4k240, encode 4k120, concurrent 4k120 decode/encode |
Audio | V66 512 KB L2 up to 1.459 GHz | V66 512 KB L2 up to 1.459 GHz | V66 2 MB L2 up to 1.459 GHz |
Security | SPU230 | SPU230 | SPU250 |
Functional safety | Safety Element out of Context (SEooC) targeting assumed ASIL B use cases | Safety Element out of Context (SEooC) targeting assumed ASIL B use cases | Safety Element out of Context (SEooC) targeting assumed ASIL B use cases. Contains dedicated Safety Manager sub-system, with lock step core |
Junction temp | -40°C to +105°C | -40°C to +105°C | -40°C to +115°C |
Display - DP | 4-lane DisplayPort v1.4 shared with USB 3.1 Gen 2 | 3 x 4-lane DisplayPort v1.4, 2x shared with USB 3.1 Gen 2 1 x 4-lane embedded DisplayPort v1.4b | 3 x 4-lane DisplayPort v1.4, 1 x shared with USB 3.1 Gen 2 4 x 4-lane embedded DisplayPort v1.4b |
Display - DSI | DSI D-PHY v1.2 4-lane DSI0 4-lane DSI1 | DSI D-PHY v1.2 4-lane DSI0 4-lane DSI1 | DSI D-PHY v1.2 4-lane DSI0 4-lane DSI1 |
Camera – CSI | CSI-2 v1.3 4-lane CSI0 4-lane CSI1 4-lane CSI2 4-lane CSI3 | CSI-2 v1.3 4-lane CSI0 4-lane CSI1 4-lane CSI2 4-lane CSI3 | CSI-2 v1.3 4-lane CSI0 4-lane CSI1 4-lane CSI2 4-lane CSI3 |
CCI-I2C | x4 | x8 | x8 |
Audio – LS-I2S | 4 x 2 data lanes each 1 x 4 data lanes each | 4 x 2 data lanes each 1 x 4 data lanes each | 6 x 2 data lanes each 1 x 4 data lanes each |
Audio – HS-I2S | 3 x 2 data lanes each, receive only | 3 x 2 data lanes each, receive only | 5 x 2 data lanes each, receive only |
Audio – TDM/PCM | 4 x 2 data lanes each 1 x 4 data lanes each | 4 x 2 data lanes each 1 x 4 data lanes each | 6 x 2 data lanes each 1 x 4 data lanes each |
Storage – UFS | 2 lane UFS 2.1 gear 3 rate A | 2 x 2 lane UFS 3.0 gear 4 rate A | 2 x 2 lane UFS 3.1 gear 4 rate B |
PCIe | 1-lane PCIe 3 (RC) 2-lane PCIe 3 (RC/EP) | 1 x 1-lane PCIe 3 (RC) 2 x 2-lane PCIe 3 (RC) 1 x 4-lane PCIe 3 (RC/EP) | 1 x 1-lane PCIe 3 (RC/EP) 2 x 4-lane PCIe 3 (RC/EP) |
Ethernet – RGMII/RMII | 1 x with MDIO 1.8 V only | 1 x with MDIO 1.8 V only | 2 x with MDIO 1.8 V or 2.5 V |
USB | 1 x USB 3.1 Gen 2 shared with DisplayPort 1 x USB 3.1 Gen 2 | 2 x USB3.1 Gen 2 shared with DisplayPort 2 x USB3.1 Gen 2 | 4 x USB3.1 Gen 2 1x shared with DisplayPort 2 x USB2.0 |
Functional safety | - | - | 20 SM-GPIOs 1 x SPI – master 1 x SPI – slave 2 x I2C – master 2-lane UART – master 4 x clock monitors 44 x voltage monitors 3 x on-board thermal monitors |
Miscellaneous SPI I 2 C UART GPIO | 26 x QUP SE (GPIO + SSC) Master and slave Master Host 174 GPIOs | 26 x QUP SE (GPIO+SSC) Master and slave Master Host 190 GPIOs | 32 x QUP SE (GPIO+SSC) Master and slave Master Host 228 GPIOs |
PMIC | 20 x GPIOs 3 x AMUX | 30 x GPIOs 5 x AMUX | 32 x GPIOs 7 x AMUX |