AGM FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The SRAM-based FPGA device, its low cost and optimized feature set makes ideal solutions for a wide array of automotive, consumer, communications, video processing, test and measurement, and other end-market solutions. AGM FPGA device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications.
Features
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High-density architecture with 6K to 10K LEs
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M9K embedded memory blocks, up to 414Kbits of RAM space
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Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers
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Provides 2 PLLs per device provide clock multiplication and phase shifting
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High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
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Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL
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General package options, LQFP and FBGA.
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Flexible device configuration through JTAG and SPI interface
Feature | AG6K, AG10K |
LUTs | 6400,10K |
EBR SRAM(Kbits) | 414 |
Maximum User I/O pins | 179 |
Number of PLLs | 2 |
Package | 144 pin LQFP 256-pin FBGA |
AG6K/AG10K FPGA 面向大批量、成本敏感的应用,使系统设计人员能够在降低成本的同时满足日益增长的性能要求。AG6K/10K这款基于 SRAM 的 FPGA 器件以其低成本和优化的功能集为广泛的汽车、消费、通信、视频处理、测试和测量以及其他终端市场解决方案提供了理想的解决方案。 AG6K/10K 器件系列为您的大容量、低功耗和成本敏感型应用提供了理想的解决方案。
特点:
6K 到 10K LE 的高密度架构
M9K嵌入式内存块,高达414Kbits的RAM空间
多达 23 个 18 x 18 位嵌入式乘法器,每个都可配置为两个独立的 9 x 9 位乘法器
每个器件提供 2 个 PLL,提供时钟倍频和移相
高速差分I/O标准支持,包括LVDS、RSDS、mini-LVDS、LVPECL
单端I/O标准支持,包括3.3V、2.5V、1.8V、1.5V LVCMOS和LVTTL
通用封装选项,LQFP 和 FBGA。
通过 JTAG 和 SPI 接口灵活配置设备
如需更多开发资料和技术支持,欢迎联系Christian.Li@china-wikon.com,或者扫码详询。