The ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA) is the leading research symposium on software testing and analysis, bringing together academics, industrial researchers, and practitioners to exchange new ideas, problems, and experience on how to analyze and test software systems.
1.会议信息
会议介绍: ACM SIGSOFT的国际软件测试和分析研讨会(International Symposium on Software Testing and Analysis, ISSTA)是软件测试和分析的领先研究研讨会,汇集了学术界、工业界研究人员和实践者,交流关于如何分析和测试软件系统的新思想、问题和经验。
会议全称: International Symposium on Software Testing and Analysis
会议网址: https://conf.researchr.org/home/issta-2023
会议地点: Seattle downtown
CCF分类: A 类
Core分类: A* 类
H5指数: 36
影响力值: 5.12
录取率: ISSTA-22,录取率:24.4% (61/250)
2.时间节点
When | Track | What |
---|---|---|
Thu 10 Nov 2022 | Technical Papers | First round submission deadline |
Tue 20 - Thu 22 Dec 2022 | Technical Papers | First round author response |
Mon 16 Jan 2023 | Technical Papers | First round paper notification |
Thu 16 Feb 2023 | Technical Papers | Second round submission deadline |
Tue 11 - Thu 13 Apr 2023 | Technical Papers | Second round author response |
Wed 3 May 2023 | Technical Papers | Second round paper notification |