An example of EDA design for four-layer PCBs and QFNs by AD and others

目录

0. Abstract:

1.Introduction.

2.Body

3. The final part: summary and acknowledgement

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0. Abstract:

This paper is a primer about AD and other EDA designs for four-layer PCBs and QFNs. Also, examples are done.
Keywords: eda; training; ad

1.Introduction.

How to do the EDA design of a four-layer circuit board? This paper is a reference.

2.Body

In EDA design, vendors such as AD (Analog Devices) provide a wealth of tools and resources that can help engineers perform efficient circuit design and analysis. When it comes to EDA design of four-layer PCBs and QFNs, here are some detailed steps:

1. Circuit design planning: Determine the goals and functions of the circuit design based on project requirements. Consider factors such as device selection, signal integrity requirements, power management, etc.

2. Circuit Schematic Design: Use PCB design software provided by vendors such as AD, such as Altium Designer, Cadence Allegro, etc. Draw the circuit schematic of a four-layer PCB. As well as signal integrity analysis tools, you can evaluate the transmission performance of high-speed signals on the four-layer PCB to ensure signal quality and stability. Ensure correct circuit connections and signal transmission paths.

3. Device library selection: Use the package libraries provided by vendors such as AD to select suitable QFN packages and ensure that the packages in the library match the dimensions and pinouts of the actual devices.

4. Layout and routing:

4.1 Perform the layout design in the PCB design software to place the circuit components on a four-layer PCB, taking into account the signal integrity, power-ground plane and RF interference, etc.

4.2 Perform wiring design to connect the signal and power lines between components to ensure good signal integrity and power stability.

5. Thermal analysis and optimisation: To address the thermal management issues of QFN packages, use thermal analysis tools provided by vendors, such as AD, to simulate, analyse and optimise the thermal conduction and heat dissipation of QFNs. Ensure the stability and reliability of the circuit during operation.

6. Manufacturing File Generation:

6.1 Generate Gerber File: Generate the Gerber file of the four-layer PCB through PCB design software, including information on the hierarchical layout, solder pads, silkscreen, etc.

6.2 Generate BOM List: Extract the list of the required devices from the schematic circuit diagrams and PCB design software.

7. PCB Manufacturing and Soldering: Place the designed four-layer PCB files to the PCB manufacturer, fabricate the PCB boards, and assemble and solder the components in QFN packages.

8. Debugging and Verification: After completing the PCB assembly, debug and verify the circuit to ensure that the circuit functions properly and the signal quality is good. The above steps provide a general guide, but the exact steps may vary depending on individual needs and practical situations. When carrying out EDA design for four-layer PCBs and QFNs, it is not only necessary to be familiar with the relevant tools, but also to combine specific design requirements and practical experience to carry out reasonable design and optimisation.

3. The final part: summary and acknowledgement

Thank you time.
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