BUK7S0R7-40HJ|Nexperia(安世)|原装现货|深圳挺鑫科技

最新推荐文章于 2024-08-14 21:08:22 发布

SZTXKJ挺鑫科技

最新推荐文章于 2024-08-14 21:08:22 发布

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分类专栏：挺鑫科技优势货源文章标签：科技

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Fully automotive qualified to beyond AEC-Q101:
- -55 °C to +175 °C rating suitable for thermally demanding environments
LFPAK88 package:
- Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
- Thin package and copper clip enables LFPAK88 to be highly efficient thermally
LFPAK copper clip technology enabling improvements over wire bond packages by:
- Increased maximum current capability and excellent current spreading
- Improved RDSon
- Low source inductance
- Low thermal resistance Rth
LFPAK Gull Wing leads:
- Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment
- Easy solder wetting for good mechanical solder joint
Unique 40 V Trench 9 superjunction technology:
- Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
- Improved SOA and avalanche capability compared to standard TrenchMOS
- Tight VGS(th) limits enable easy paralleling of MOSFETs