ESD Association Advisory ESD ADV1.0-2017-DEFINITIONS-I

IC

integrated circuit

IDM

See integrated device manufacturer.

Ifail: failure current

TLP current after which device behavior is permanently changed, typically the minimum of Isoft

and It2.

impedance, symbol Z

The total opposition (i.e., resistance or reactance) a circuit offers to the flow of alternating current. It is measured in ohms and the lower the ohmic value, the better the quality of the conductor.

inductive charging

The transfer of an electric charge to an object when it is momentarily contacted to ground in the presence of an electric field.

initial test voltage

The voltage on the test plate of the periodic verification instrument at which the discharge time test begins.

input protection

Structures, devices or networks connected at the input terminals of an item to prevent electrostatic discharge damage.

insulated conductor

A conductor encased within material of composition and thickness that is recognized as electrical insulation.

insulative materials

A material that has a surface resistance or a volume resistance equal to or greater than 1 x 1011 ohms.

integrated device manufacturer (IDM)

A type of semiconductor company which designs, manufactures, and sells integrated circuit products.

intended ESD current path

Set of devices and interconnects specifically designed to dissipate ESD charge. ESD protection network for two pins may consist of a single ESD current path or multiple parallel ESD current paths. The goal of ESD EDA checks is to verify that intended ESD current path implementation is compliant with ESD design requirements.