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SMT 不良描述中英文对照
常用英语词汇与缩写:
Accuracy:精度
Additive Process:加成工艺
Adhesion:附着力
Aerosol:气溶剂
Angle of attack:迎角
Anisotropic adhesive:各异向性胶
Annular ring:环状圈
Application specific integrated circuit :ASIC特殊应用集成电路Array:列阵
Artwork:布线图
Automated test equipment:ATE自动测试设备
Bond lift-off:焊接升离
Bonding agent:粘合剂
CAD/CAM system:计算机辅助设计与制造系统
Capillary action:毛细管作用
Chip on board :COB板面芯片
Circuit tester:电路测试机
Cladding:覆盖层
Cold cleaning:冷清洗
Cold solder joint:冷焊锡点
Conductive epoxy:导电性环氧树脂
Conductive ink:导电墨水
Conformal coating:共形涂层
Copper foil:铜箔
Copper mirror test:铜镜测试
Cure:烘焙固化
AOI(Automatic optical inspection):自动光学检查Assembly:组件
ATE(Automated test equipment):自动测试设备
Bare Chip:裸芯片
BGA(Ball grid array)球栅列阵
Blind via:盲孔
Blowholes:吹孔
Bridge:锡桥
Bridging:搭锡
bulk feeder:散装式供料器
Buried via:埋孔
Chamber System:炉膛系统
Chip:片状元件
Circuit tester:电路测试机
cleaning after soldering:焊后清洗