Detailed understanding of MEMS laser welding

Nowadays, with the development of integrated circuits, more and more welding technologies have been developed to meet the welding needs of small components. The emergence of laser welding makes the welding of small components more efficient and accurate. The rapid development of laser welding has been gradually adopted by more and more semiconductor manufacturers.

During MEMS packaging, the chip can be planted to make micro-convex points, and the chip and the substrate can be welded. Current MEMS processes include reflow welding and laser welding. Both are widely used in semiconductor package welding technologies. As shown in the figure below, when the MEMS inverted planting ball is installed, the welding ball is sprayed by the laser transmitter and forms a micro-convex point on the chip. Compared with the slow heat transfer heating of reflow welding, laser welding can be used as a local heating method for rapid local heating of a specific welding area. After the laser beam is focused through the lens, it has a high energy density and shines on the welding area to form a local high temperature to dissolve the solder and weld the component. Laser welding time often takes only a few seconds to complete. Laser welding usually uses a wavelength of 900-980nm laser. In addition, the flexible movement of the space can be realized by changing the laser emission Angle. For MEMS components of very small size, laser welding has obvious advantages.

Figure 1: Laser welding printing

The laser welding process mainly includes pre-heating the solder paste, and then melting and wetting the solder pad by heating the solder paste with the laser. MEMS micromechanical structure is vulnerable to stress damage, laser welding can be accurate and rapid heating, the thermal shock is small, effectively ensure the reliability of welding. Unlike IC components, MEMS is highly sensitive to the environment, and impurities in the application environment may affect component accuracy. There is very little residue after laser welding, which greatly reduces the damage to the precision of the components.

In the final MEMS sealing cap, laser welding can form a high heat source in the sealing cap area and make the soldered material form a firm solder joint and weld, so that the MEMS component is sealed inside. Various types of caps such as ceramic or metal can be welded using laser welding. The resulting thermal stress is low, effectively protecting the internal components.