How is solder paste made?

The main materials that need to be prepared to make solder paste include tin powder, flux and substrate. Among them, tin powder is the main ingredient, while flux and substrate are auxiliary ingredients, which can improve the soldering quality and processability.

The process of making solder paste mainly includes the following steps:

1, mix tin powder, flux and substrate according to a certain ratio. This ratio needs to be adjusted according to the specific process requirements and product performance, the general content of tin powder is more than 90%.

2, mix the mixed powder with the adhesive, and then put it into a high-speed mixer for mixing. Stirring time is generally about 30 minutes to ensure that the various ingredients are mixed evenly.

3, the mixed solder paste into the dissolving tank, heated to the appropriate temperature, so that it dissolves evenly, and remove the air in it to ensure product quality. Then the dissolved solder paste is filtered to remove the impurities, improve product purity, and prevent clogging of nozzles or pins.

4、Fill the filtered solder paste into the empty syringe. When filling, you need to pay attention to the paste consistency should match the diameter of the nozzle used.

5、If the solder paste contains solvent, it needs to be dried so that the solvent evaporates and the resin forms a solid. This process requires temperature and time control to ensure the quality and performance of the solder paste.

6、Check the fluidity and viscosity of the solder paste, if need to be adjusted, you can add the right amount of solvent or resin. This step is to ensure that the solder paste meets the specific process requirements.

7、The filled solder paste will be tested for performance, mainly including solder life test, temperature change test, electrical performance test, etc. to ensure the quality and stability of the product.

8, the production of good solder paste for packaging, stored in sealed containers to prevent moisture and dust and other pollution. At the same time, you need to label the container with the production date of the solder paste, production batch and other information.

There are also some important control factors to pay attention to in the solder paste making process. For example, stirring time, stirring speed and stirring method will affect the quality and performance of the solder paste. Stirring time is generally between 30 minutes and 4 hours, and stirring speed is about 180-200 rpm. if the stirring time is too long or the speed is too fast, it may affect the quality and performance of the solder paste.

Next, I recommend Fuyinda solder paste. Fuyinda solder paste has various models and specifications to meet the needs of different scenarios. For example, ultra-micro solder paste, gold solder paste, multiple reflow solder paste and water-soluble solder paste. Among them, ultra-micro solder paste is suitable for thin substrates, non-heat-resistant devices, high-reliability device packaging applications; gold solder paste is one of the most reliable microelectronics and semiconductor soldering materials on the market, suitable for the military, aerospace, medical equipment, etc.; multiple reflow solder paste can solve the problem of inconsistency in the reliability of the two reflow joints; and water-soluble paste is a kind of special type of solder paste used for electronic component welding. Water-soluble solder paste is a special type of solder paste used for soldering electronic components. Fuyinda's solder adhesive products (also known as epoxy solder paste) are high-strength soldering products prepared by combining alloy solder powder with excellent sphericity, uniform particle size, low oxygen content and high strength with halogen-free epoxy flux. This kind of tin glue products in the welding and curing process only a very small amount of solvent volatilization, welding will not form a solder ball after welding. After the solder powder melts and shrinks, the solder joints are connected by metallurgy. The flux residue becomes a thermosetting adhesive, which strengthens the solder joints and provides corrosion protection and insulation. Fuyingda's solder adhesive products are characterized by no-cleaning, anti-corrosion and high insulation, which is a new type of electronic packaging material. If you are interested, please feel free to come to communicate and negotiate!

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