Wetting reaction of lead-free eutectic solder on a metallized layer under a thick Cu bump

The wetting reaction of lead-free eutectic solder on the metallized layer under thick Cu bumps involves many aspects, the following is a detailed analysis of this process:

We compare the reactions of four different eutectic solders (SnPb, SnAg, SnAgCu and SnCu) on a thick Cu (15 μm) UBM layer prepared by electroplating.

SEM photo of interconnect interface of 4 kinds of eutectic solders on Cu UBM layer after 2 reflow (c)

(a)SnPb; (b)SnAg; (e)SnAgCu; (d)SnCu

Optical microscope photos at the interface between Cu and 4 kinds of solders after solid aging at 170℃ for 1500h (a)SnPb; (b)SnAg; (c)SnAgCu; (d)SnCu

Formation of scalloped Cu6Sn5

Scalloped Cu6Sn5, a typical intermetallic compound (IMC) formed by Cu reacting with Sn-based solder, was observed in all samples.

The spiky Cu6Sn5 at the interface between lead-free solder and Cu is larger than that at the interface of SnPb solder, which may be related to the composition of lead-free solder and reflux conditions.

Formation of Ag3Sn intermetallic compounds

In SnAg and SnAgCu solders, very large flaky or spike-like Ag3Sn intermetallic compounds were observed. The formation of these IMCs is related to the Ag content in the solder, which reacts with Sn to form Ag3Sn.

Effect of solid state aging on IMC morphology:

During the solid aging process, the scalloped Cu6Sn5 morphology becomes layered morphology, and with the continuous diffusion of Cu atoms, a layer of Cu3Sn is obviously formed. This suggests that IMCs undergo changes in morphology and composition during aging.

During the aging process of SnPb solder, the solder matrix grains generally grow, and a PB-rich layer is formed near the CuSn layer. This may be related to the phase transition and element diffusion of SnPb solder, and Pb does not react with Cu IMC.

The grain growth of lead-free solder is not obvious during the aging process, which may be related to the composition and stability of lead-free solder.

Cu consumption

The amount of Cu consumed during solid aging is of the same order of magnitude as that consumed in the wetting reaction, although the time difference is up to 4 orders of magnitude. This indicates that the formation rate of IMC in the wetting reaction is much higher than that in the solid state aging process, which is related to the concentration of metal atoms.

This may be because the wetting reaction is carried out at high temperatures and the solder is in direct contact with the Cu matrix, which is conducive to the rapid formation of IMC. The solid-state aging process is carried out at a lower temperature, and the element diffusion and reaction rate are slow.

Conclusion:

There are significant differences in the reactions of SnPb solder and lead-free solder on Cu UBM layer, especially in the formation and morphology of IMC.

The lead-free solder showed good stability during solid aging, and the grain growth was not obvious.

The formation rate of IMC in the wetting reaction is much higher than that in the solid state aging process, which may be related to temperature, element diffusion rate and solder composition.

This information is important for selecting the right solder and optimizing welding process parameters to ensure the reliability and long-term stability of electronic products.

reference

 [1]K,N.Tu and K.Zeng,“Tin-lead ( $nPb) solder reaetion in flip chip tech-nology,"  MaterialsScienee and Engineering Reports,R34,1-58 (2001).(Review paper)

[2]K.Zeng and K.N.Tu , "Six cases of reliability study of Pb-free solder joints in electron packagingtechnology,"  Materials Seience and Engineer -ing Reports, R38, 55 - 105 ( 2002 ).( Reviewpaper )