Summary of properties of lead-free solder alloys

What is lead-free solder?

Lead-free solder (PB-free solder) means that the chemical composition of the solder does not contain lead (Pb), and the Rohs directive requires that the Pb content does not exceed 1000PPM or 0.1%. The main representative of lead-free solder is tin base solder, and the most used lead-free solder is tin silver copper lead-free solder, which is considered by the industry as the best choice to replace tin lead solder. The following is a summary of the practical and physical properties of lead-free solder alloys:

Industrial practical requirements

The application of lead-free solder alloys in the electronics industry needs to meet the following requirements to ensure their widespread use and reliability in actual production

1. Melting point: The melting point should be as close as possible to the SnPb eutectic filler metal (about 183 ° C), which can avoid substantial modifications to the existing equipment, process parameters and substrate, and contribute to the rapid promotion and application of lead-free filler metal.

2, electrical conductivity: due to the small soldering spot on the electronic assembly parts, the electrical conductivity of the brazing head is particularly important. Good electrical conductivity can avoid the generation of resistance heat, which has an adverse effect on the reliability of the brazed joint.

3, wettability: good wettability is a prerequisite for the formation of a good brazing head. The solder with good wettability can better cover and fill the welding surface to form a more reliable connection.

4, mechanical properties: brazing head in the electronic assembly to play a mechanical connection role, so lead-free solder alloy should have good mechanical properties, including strength, toughness, etc., to cope with thermal shock, mechanical vibration, high temperature and other harsh environment.

Physical properties of main elements of lead-free solder alloy

Lead-free solders usually use metal elements such as Ag, Cu, Sb, Bi, and In to replace Pb in SnPb solders. These metal elements have different physical properties that affect the properties of the alloys they are composed of. Here are the physical properties of some of the main elements (including Pb for comparison) :

Silver (Ag) : has high electrical and thermal conductivity and is often used to improve the electrical conductivity of brazing materials.

Copper (Cu) : Also has high electrical and thermal conductivity, and is a commonly used additive element in lead-free brazing.

Antimony (Sb) : used to improve the mechanical properties and wettability of brazing metals.

Bismuth (Bi) : Low melting point, can reduce the melting point of the solder, but poor electrical conductivity.

Indium (In) : Also has a lower melting point, but costs more.

The combination and proportion of these elements will directly affect the overall properties of lead-free solder alloys. Therefore, when developing lead-free solder, it is necessary to consider the influence of various elements comprehensively, and optimize the properties of the alloy by adjusting the composition and proportion of elements.

The following table shows the basic physical properties of related metal elements in lead-free brazing materials (the physical properties of Pb are also included for comparison).