MAX6675驱动（STM32，K 热电偶）

一、前期准备
单片机：STM32F103ZET6
开发环境：MDK5.27
库函数：STM32Cube FW_F1 V1.8.0
MAX6675模块：淘宝有售

二、实验效果
仿真：

三、驱动原理
参考MAX6675数据手册。
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四、驱动代码
max6675.h

#ifndef __MAX_6675_H__
#define	__MAX_6675_H__
#include "stm32f1xx_hal.h"
#include "gpio.h"
#include "stdio.h"
#define	CS	PAout(4)

typedef enum
{
	Device_Offline = 0,
	Device_Online = 1,
}MAX6675_Status;

typedef struct
{
	uint16_t Row_Data;
	MAX6675_Status Device_State;
	float Temperature;
}MAX6675_Data_T;

extern	SPI_HandleTypeDef hspi1;
extern MAX6675_Data_T Thermocouple_K;
extern void survice_MAX6675(void);
#endif

max6675.c

#include "max6675.h"

MAX6675_Data_T Thermocouple_K = 
{	0, 
	Device_Offline, 
	0.0f
};

void survice_MAX6675(void)
{
	uint8_t data[2] = {0};
	
	CS = 0;
	HAL_Delay(2);
	HAL_SPI_Receive(&hspi1, data, 2, 0xFFFF);
	CS = 1;
	HAL_Delay(2);
	
	Thermocouple_K.Row_Data = 0;
	Thermocouple_K.Row_Data = (data[1] << 8) | data[0];
	
	if ((Thermocouple_K.Row_Data >> 2) & 0x01)
	{
		Thermocouple_K.Device_State = Device_Offline;
	}
	else
	{
		Thermocouple_K.Device_State = Device_Online;
	}
	
	Thermocouple_K.Temperature = (float)(((Thermocouple_K.Row_Data >> 3) & ~(0xF << 12)) * 0.25f);
}

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