多层印制电路板的对位工艺

多层印制电路板的对位工艺*  

李园¹⁺,  邓锐²

¹(广东海洋大学 信息学院软件技术系嵌入1061班，湛江524000)

²(广东海洋大学 信息学院软件技术系，湛江  524000)

The Positioning Technology Of Multi-layer Printed Circuit Board

LI Yuan¹⁺ , DENG Rui²

¹(Class Embedded 1061, Department of Software Technology, School of Information GuanDong Ocean University,

Zhanjiang 524088,China)

²(Department of Software Technology, School of Information GuanDong Ocean University, Zhanjiang 524000, China)

+ Corresponding author: Phone: +86-13763074402，E-mail: liyuanempire@163.com, http://www.gdou.edu.cn

 

Abstract:   The positioning is very important in the making multi-layer printed circuit board. In this paper has expatiated the setting of positioning hole, the method of drilling, the positioning between the film and each printed circuit board layer and the positioning and fixed in each printed circuit board layer in the simple laboratory environment.Thereby it has achieved the positioning of printed circuit board accurately.

 

Key words:   positioning hole, positioning

摘  要:     多层印制电路板的对位是电路板制作中的一个至关重要的环节。本文详细阐述了在实验室简易环境下多层电路板对位工艺中定位孔的设置、钻孔的方法、菲林与各层电路板的对位以及各层电路板间的对位和固定，从而实现多层