Professional English in Semiconductor
Words
Words | Translation |
---|---|
die | 芯片 |
wafer | 晶圆 |
substrate | 基板 |
baseplate | 底板 |
encapsulation | 封装,塑装 |
plate | 电镀 |
epitaxy | 外延Epi |
bump | 凸点 |
voids | 空洞microns |
Lids | 金属罩 |
etch | 刻蚀 激光刻蚀 laser etching |
coplanar | 共面 |
coplanirity | 共面性 |
mount | 贴装 solderball mount |
attach | 贴装die attach |
assembly | 装配 |
soldering | 焊接 |
sintering | 烧结 |
deposition | 沉积 |
pitch | 间距 |
Warpage | 翘曲、弯曲 |
plasma | 等离子体 |
polyimide | 聚酰亚胺 |
epoxy | 环氧树脂 |
silicone gel | 硅胶 |
mechanism | 机制 |
corrosion | 腐蚀 |
alloy | 合金 |
particle | 粒子 |
shear strength | 剪切力 |
Fab | alt. foundry factory |
Fabless | Fab + Fabless = complete chip flow |
intermetallicsIMs | 金属间化合物 |
eutectic | 共晶 |
porosity | 孔隙NANO - micron |
delamination | 分层 |
phosphors | 荧光粉 |
wear-out | 疲劳、磨损 |
catastrophic failure | 突然失效 |
empirical | 经验性的 |
atomic molecular | 原子 分子 |
Abridge
Abreviation | Full-name | Translation |
---|---|---|
SBM | Solder Ball Mount | 焊球贴装 |
UBM | Under Ball Material | 球下金属 |
TIM | Thermal Interface Material | 热表面材料 |
LIS | Lead Inspection | 引脚检测 |
BGA | Ball Grid Array | 球栅阵列 |
FcBGA | Flip Chip Ball Grid Array | 倒装球栅阵列 |
GPU | Graphics Processing Unit | 图形处理单元 |
ELK | Extreme Low-k Dielectric | 超低介电系数 |
DBC | Direct Bonded Copper | 覆铜板 substrate |
DBA | Direct Bonded Aluminum | 覆铝板 substrate |
DP | Die Preparation | DS Die Sawing |
PCB | Printed Circuit Board | 印刷电路板 |
LD | lead | 引脚lead free 不含铅的 |
TLP | Transient Liquid Phase Bonding | 瞬间液相键合 |
SLID | Solid Liquid Interdiffusion Bonding | 固液互扩散键合 |
CTE | Coefficient of Thermal Expansion | 热膨胀系数 |
ASIC | Application-Specific Integrated Circuit | 专用集成电路 |
FPGA | Filed Programmable Gate Array | 可编程门阵列 |
SoC | System on Chip | |
MEMS | Micro Electronic Mechanical System | 微机电系统 |
OSAT | Out Sourced Assembly and Test | 外包封测 |
IDM | Integrated Design Automation | 集成设计自动化 |
LTJT | Low Temperature Joining Technology | 低温连接技术 |
RDL | Redistribution Layer | 重构线层 |
SEM | Scanning Electron Microscope | 扫描电镜 |
IMS | Insulated Metal Substrate | 绝缘金属基板 |
DfR | Design for Reliability | 可靠性设计 |
FE | Finite Element | 有限元 |
DOE | Design Of Experiment | 实验设计 |
EMC | Epoxy Molding Compound | 环氧塑膜料 |