1.会议
IEEE International Solid-State Circuits Conference,简称:ISSCC,国际固态电路会议
(顶会,每年仅有200篇左右)
IEEE International Electron Devices Meeting,简称:IEDM,国际电子器件会议
IEEE Symposia on VLSI Technology and Circuits,简称:VLSI,超大规模集成电路研讨会
European Solid-State Circuit Conference,简称:ESSCIRC,欧洲固态电路会议
IEEE Asian Solid-State Circuits Conference,简称:A-SSCC,亚洲固态电路会议
Hot Chips: A Symposium on High Performance Chips,简称:Hot Chips,高性能芯片研讨会
IEEE International Symposium on Circuits and Systems,简称:ISCAS,电路系统研讨会
IEEE/ACM International Symposium on Microarchitecture,简称:MICRO,微架构
International Symposium on Computer Architecture,简称:ISCA,计算机体系架构
International Symposium on High-Performance Computer Architecture,简称:HPCA,高性能计算机架构
International Conference on Architectural Support for Programming Languages and OperatingSystems,简称:ASPLOS,编程语言和操作系统的体系结构支持国际会议
Design Automation Conference,简称:DAC,设计自动化会议
IEEE International Symposium on Power Semiconductor Devices and ICs,简称:ISPSD,功率器件、电路研讨会
IEEE Radio Frequency Integrated Circuits Symposium,简称:RFIC,射频集成电路研讨会
IEEE Custom Integrated Circuits Conference,简称:CICC,集成电路会议
IEEE International Conference on Computer-aided Design ,简称:ICCAD,计算机辅助设计国际会议
ACM/IEEE International Symposium on Low Power Electronics and Design,简称:ISLPED,低功耗电子设计研讨会
Design, Automation and Test in Europe Conference and Exhibition,简称:DATE,欧洲设计、自动化、测试会议
2.期刊
IEEE Journal of Solid-State Circuits ,简称:JSSC (顶刊)
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,简称:TCAD
IEEE Transactions on Circuits and Systems I,简称:TCAS-I (一区)
IEEE Transactions on Circuits and Systems II,简称:TCAS-II (一区)
IEEE Transactions on Very Large Scale Integration ,简称:TVLSI
ELECTRONICS LETTERS,简称:EL
3.汇总:
电路设计的话, 会议: ISSCC > VLSIC > ESSCIRC/CICC/RFIC > ASSCC > ISCAS > 各种local CAS (APCCAS, MWSCAS等)
期刊:JSSC > SSC-L ~ TCAS-I ~ TPE ~ TBIOCAS > TCAS-II >TVLSI > EL …
4.EDA方向:
DAC(国际设计自动化会议,Design Automation Conference)、
ICCAD(国际计算机辅助设计会议,International Conference on Computer Aided Design)、
DATE(欧洲设计自动化与测试学术会议,Design, Automation and Test in Europe)
ASP-DAC(亚太地区设计自动化会议,Asia and South Pacific Design Automation Conference)
一起被公认为电子设计自动化领域水平最高的四大国际会议。
DAC和ICCAD会议固定在美国举办,DATE欧洲举办,ASP-DAC在亚太举办