集成电路中的die的概念

在集成电路的上下文中，管芯是半导体材料，在其上给定的功能性电路制作的一小块。通常，集成电路生产中的电子级硅（EGS）或其它半导体（如GaAs）通过诸如光刻工艺在单个晶片上大批次。在晶片被切割（“切块”）成许多块，每一个包含该电路的一个副本。每个块被称为一个模。

A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

http://en.wikipedia.org/wiki/Die_(integrated_circuit)