1、Board Geometry/Silk_screen Top,放公司LOGO;
2、allegro查找元器件,Display/Assign color,Find中选择symbol or pin,在输入框输入元器件号,回车可找到位置;
3、添加VIA,Cmgr/Physical/Physical Costraint Set/All Layers/Vias,左侧选择via_lzy;
4、PAD_LZY,内径:0.3048mm,外经:0.5080;
5、群组走线,到达末端后,右键/single line mode,可以更改为单线操作模式;
6、Slide命令,Find栏选择Cline segs,推挤走线;
7、过孔替换,选择旧过孔,右键+Replace padstack+ All instances + 选择新过孔 + OK;
8、Z-COPY命令,Options选择Contract,打勾Create dynamic shape,在GND层覆铜;
9、改变覆铜边界区域,Shape select,选择铜皮,选择Shape/edit boundary;
10、去除铜屑,镂空铜皮,Shape/Manual Void+polygon +画多边形;
11、整体框选改变丝印字体大小,change/text+框选+选择右侧字体;