halcon方法1----blob分析

图像处理要求：检测电路板的焊球位置以及面积半径

例程：HALCON-18.11-Steady\examples\hdevelop\Applications\Completeness-Check\ball.hdev

处理思路：

        1.焊接球和上部分图像阈值接近，直接阈值筛选不易分离，分两步：先划分下部分区域，在阈值提取。

        2.connection连通区域然后select_shape筛选

read_image (Bond, 'die/die_03')
threshold (Bond, Region, 100, 255)
shape_trans (Region, RegionTrans, 'rectangle2')
reduce_domain (Bond, RegionTrans, ImageReduced)
threshold (ImageReduced, Region1, 0, 50)
fill_up_shape (Region1, RegionFillUp, 'area', 1, 100)
opening_circle (RegionFillUp, RegionOpening, 15.5)
connection (RegionOpening, ConnectedRegions)
select_shape (ConnectedRegions, SelectedRegions, 'circularity', 'and', 0.8, 1)
sort_region (SelectedRegions, SortedRegions, 'first_point', 'true', 'column')
smallest_circle (SortedRegions, Row, Column, Radius)