ESD和EOS芯片损伤怎么判定

ESD(Electrostatic Discharge)和EOS(Electrical Over-Stress)芯片损伤的判定一般需要使用专业的测试设备。

通常的做法是对芯片进行功能测试,以确定其是否已经损坏。如果芯片功能异常,可以进一步使用观察和扫描电子显微镜等工具来确定损伤的类型和位置。

除此之外,还可以使用静电放电(ESD)模拟器来模拟ESD事件,以验证芯片是否对ESD具有足够的抗损能力。

总之,ESD和EOS芯片损伤的判定需要结合多种方法和工具,才能得出准确的结论。

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EOS/ESD Q. What is the EOS ? A. By definition, electrical overstress (EOS) is "the exposure of an item (an electronic component, for example) to a current or voltage beyond its maximum rating. This exposure may or may not result in a catastrophic failure of the item." Typically, it can be inferred that an overstress has occurred when an item fails to meet its electrical characteristics. Determining whether the failure was caused by an ESD event or some other type of overstress is often more difficult. In addition, overstress may result in latent damage to an item. This damage is not immediately detected in its electrical properties, but could result in a failure of the item later. EOS due to : Ø Electromagnetic pulses (EMP) Ø Electrostatic discharge (ESD) Ø System transients Ø Lightning ESD/EOS Differences Typically generated by: q Power supplies q Test equipment q Event usually lasts from millisecond to seconds Typically > 50us pulse Indications : q Blown metal Lines q Molten Damage q Usually Thermal q High power Subset of EOS q Limited Energy q Usually caused by static q Event lasts from nano to microseconds Not easily visible q Gate oxide breakdown q Junction spiking q Latch up Not always restricted to I/O q May cause functional fails EOS ESD EOS Causes and Effects q Inadequate Work Procedures v Hot switching Insertion / removal of components with power on / not fully powered down. v Inadequate Training. q Poor board design v Transmission of pulses from other equipment e.g... noise form switch mode power supplies. q Poor test development v Test applies signals before powering up chip. v Maximum operating conditions exceeded. q Work Procedures v Documented test/assembly flows. v Correct insertion of devices - use pictorial reminders. v Beware of powered insertions and removals. v Check connections. q Maintenance / Line Monitoring v Equipment not grounded. v Loose connections causing intermittence events. v Poor wire management. v No AC line monitoring. q Board / C

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