3BHB021400R0002 IGCT（集成栅极整流晶闸管）

3BHB021400R0002本文提供了有关使用IGCT（集成栅极整流晶闸管）技术的固态开关的电感耦合和测试程序的信息。该开关是为线性粒子束加速器和速调管调制器等应用而设计的。文本中的要点包括：
电感耦合和电源：
图6显示了与输入变压器的电感耦合，为驱动器单元供电。
高压电缆穿过输入变压器并连接到电流源电源。
在辅助电源故障的情况下，电源仍然可以为驱动器单元充电以进行关闭操作。

开关测试：
IGCT装置在生产线上进行常规测试，包括全阻断电压和开关能力。
记录的值被协议化。
一个开关组件的设备取自同一生产批次，以最大限度地减少漏电流差异并优化电压共享。
组装后进行功能测试，重点关注触发延迟和设备之间的抖动。
测量开启和关闭时的门信号延迟，可接受的容差为100ns。
型式试验在满载条件下进行，包括1850A、4400Vdc、2ms脉冲宽度和2 Hz重复频率，持续10分钟，直到热稳定。

可靠性和寿命估计：
IGCT装置已经在类似应用中使用了8年，没有出现故障。
在可比较的调制器应用中，IGCT装置的累积操作小时数为80-6小时而没有问题。
对组件中的所有组件检查FIT（故障时间）率。
半导体器件（IGCT）具有1的低FIT率，而驱动器单元和电源具有较高的FIT率（分别约为2000和1000）。
计算表明，假设海平面条件和+40°C，在连续使用11年之前，预计不会出现第一次故障。
总的来说，本文强调了基于IGCT的固态开关的可靠性和稳健性，详细介绍了基于其组件FIT率的测试程序和寿命估计。

The text provides information about the inductive couplings and testing procedures for a solid-state switch using IGCT 3BHB021400R0002 
 (Integrated Gate Commutated Thyristor) technology. The switch is designed for applications like linear particle beam accelerators and klystron modulators. Key points from the text include:

Inductive Couplings and Power Supply:

Figure 6 illustrates the inductive couplings with input transformers to power the driver units.
The high-voltage cable is routed through the input transformers and connected to the current source power supply.
In case of auxiliary power failure, the power supply can still charge the driver units for a switch-off operation.
Switch Tests:

IGCT 3BHB021400R0002  devices undergo routine tests in the production line, including full blocking voltage and switch-on/switch-off capability.
Recorded values are protocolized.
Devices for one switch assembly are taken from the same production lot to minimize differences in leakage current and optimize voltage sharing.
Functional tests are conducted after assembly, focusing on trigger delay and jitter between devices.
Gate-signal-delay at turn-on and turn-off is measured, with an acceptable tolerance of 100 ns.
Type tests are performed under full-load conditions, involving 1850A, 4400Vdc, 2 ms pulse width, and 2 Hz repetition rate for 10 minutes until thermal stabilization.
Reliability and Lifetime Estimations:

IGCT 3BHB021400R0002  devices have been used for 8 years in similar applications without failure.
The cumulative hours of operation for IGCT 3BHB021400R0002  devices in comparable modulator applications are 80-6 hours without issues.
FIT (Failure In Time) rates are checked for all components in the assembly.
The semiconductor device (IGCT) has a low FIT rate of 1, while the driver unit and power supply have higher FIT rates (around 2000 and 1000, respectively).
Calculations suggest that the first failures are not expected before 11 years of continuous use, assuming sea-level conditions and +40°C.
Overall, the text emphasizes the reliability and robustness of the IGCT-based solid-state switch, detailing the testing procedures and lifetime estimations based on the FIT rates of its components.