BGA
封装互连焊点温度及电流密度分布的模拟与验证
薛明阳
;
卫国强
;
黄延禄
;
姚健
【期刊名称】
《航空制造技术》
【年
(
卷
),
期】
2011(000)017
【
摘
要
】
The
current
density
in
the
interconnecting
solder
joint
is
increased significantly, which brings new challenges to the reliability of
electronic
products.
Finite
element
software
is
used
to
simulate
the
distribution of temperature and current density in BGA package solder
joints,
the
numerical
simulation
results
show
that
there
is
a
great
temperature
difference
between
chip
side
and
substrate
side
of
solder
joints, the max
imum temperature gradient reaches 5.38× 103K/cm, the
current
crowding
exists
at
the
entrance/exit
of
current
in
solder
joints,
the current density is 2-3 orders of magnitude higher than the average
one.
Meanwhile,
the
results
of
simulation
are
also
compared
with
the
well-designed experiment, which are in good agreement with the actual
experimental
ones.%
芯片互连焊点承受的电流密度越来越大
,
给电子产品的服
役可靠性带来了新的挑战
.
本文利用有限元软件对
BGA
封装互连焊点内温度及
电流密度分布进行了模拟分析
,
结果表明
:
互连焊点的芯片端和基板端存在很大的
温度差
,
在本模拟条件下
,
最大温度梯度可达到
5.38×103K/cm;在焊点的电流
入口
/
出口处存在电流拥挤
,
其电流密度比平均电流密度大
2-3
个数量级
.
并和实
际测量的焊点温度进行了比较
,
模拟分析与实际器件温度测量结果吻合较好
.
【总页数】
4
页
(75-77,93)