地平线—征程2(Journey 2-J2)芯片详解(1)—芯片概况

写在前面

本系列文章主要讲解地平线征程2(Journey 2-J2)芯片的相关知识,希望能帮助更多的同学认识和了解征程2(Journey 2-J2)芯片。

若有相关问题,欢迎评论沟通,共同进步。(*^▽^*)


 错过其他章节的同学可以电梯直达目录↓↓↓

地平线—征程2(Journey 2-J2)芯片详解——目录-CSDN博客


1. 芯片概况

1.1 芯片介绍

征程2(Journey 2-J2)是地平线机器人公司研发的一款高性能、低功耗的人工智能(AI)芯片。基于地平线自研的BPU( Brain Processing Unit ),该方案可以帮助车辆实现高性能的视觉感知,加速智能驾驶的落地。

J2拥有双核Cortex A53,可提供超过 4 TOPS的算力,典型功耗仅 2 瓦,能够高效灵活地实现多类场景任务处理,对多类目标进行实时检测和精准识别。J2 充分体现 BPU 架构强大的灵活性,全方位赋能汽车智能化。

1.2 芯片框图

J2的框图中包含CPU子系统、BPU子系统、DDR子系统、VIO子系统、PMU子系统、并行接口和存储等等。具体详见下图所示:

1.3 芯片特性

芯片的特性如下所示:(还是比较多的 o(╥﹏╥)o)

General

  • TSMC 28HPC+ (High Performance Compact Plus) Process(高端制程)
  • FCBGA388 Package with 0.8 mm pitch, 17 mm x 17 mm size(小尺寸)
  • Automotive AEC-Q100 Grade 2 compliant (operating temperature: -40~105 ℃)(宽温度)
  • Typical power consumption: 2 W(低功率)
  • Designed for ADAS and high-level autonomous driving applications(多种应用)

CPU

  • Dual-core ARM® Cortex® A53, with 32 KB/32 KB L1 I/D cache and 512 KB L2 cache(双核不得了)
  • Supports FPU and NEON
  • Separate VDD_CPU voltage domain
  • 1 GHz@VDD_CPU = 0.9 V
  • Supports Dynamic Voltage and Frequency Scaling (DVFS)
  • Integrated GIC400 Interrupt Controller
  • CoreSight debug and trace, including self-hosted debug

BPU

  • Dual-core Bernoulli-architecture BPU consisting of BPU0 and BPU1(这个是自研的,真自研)
  • Separate power domain for each core, VDD_CNN0 for BPU0, VDD_CNN1 for BPU1
  • 800 MHz@VDD_CNN* = 0.92 V
  • Supports Dynamic Voltage and Frequency Scaling (DVFS)
  • Supports separate power-down for each core
  • Supports mainstream neural networks
  • Advanced toolkit supported by Horizon Robotics

DDR

  • Supports x32 off-chip LPDDR4 DRAM(直接DDR4,高端)
  • Up to 2 GB capacity
  • Separate VDD_DDR voltage domain for DDR Controller and DDR PHY
  • Up to 2133 Mbps@VDD_DDR = 0.9 V
  • Up to 2667 Mbps@VDD_DDR = 1.0 V
  • Embedded performance monitor measuring bandwidth, latency, and other metrics on internal bus and DDR Controller, used for debug and performance optimization

Video In/Out and Pre-processing

  • Supports MIPI CSI video input(MIPI输入)

— 1 clock lane and up to 4 data lanes

— Up to 2.0 Gbps per data lane, peak transmission rate of 8 Gbps over four lanes

— Up to 4096 x 4096 pixels@30fps video input

— Supports RAW 8-/10-/12-/14-bit format and 8-/10-bit YUV 422 format

  • Supports parallel DVP video input(DVP输入)

— 12-bit data bus interface

— Input clock up to 160 MHz

— Up to 1080P@30fps video input

— Supports RAW 8-/10-/12-/16-/20-bit format and 8-/10-bit YUV 422 format

  • Supports BT1120 video input(BT1120输入)

— 16-bit data bus interface

— Input clock up to 160 MHz

— Up to 2560 x 1440 pixels@30fps video input

— Only 8-bit YUV 422 format

  • Inserts Frame_ID into input YUV 422 video stream to synchronize intelligent analysis results and video frames
  • Supports video in-to-out bypass

— MIPI CSI RX to MIPI CSI TX back-to-back bypass

— DVP IN to DVP OUT feedthrough bypass

— BT1120 IN to BT1120 OUT feedthrough bypass

  • Supports dual-camera video input through MIPI CSI RX, in side-by-side manner or using 2 virtual channels that requires external chip assistant
  • Built-in Image Signal Processor (ISP) supporting RAW to YUV conversion, with other image enhancements
  • Image Processing Unit (IPU)

— Supports cropping and downscaling, storing images into DDR in YUV420 semi-planar format

— Supports dual-camera division, cutting side-by-side images or demultiplexing 2 virtual channels, storing images of each channel into DDR separately

  • Pyramid (PYM)

— Input images from IPU (online mode) or from DDR (offline mode)

— Input image size up to 2048 x 2048

— Generates multi-layer pyramid images with various dimensions

— Configurable layers, Region of Interest (ROI), and scaling factors

  • Image display by Intelligent Analysis Result (IAR) via the MIPI CSI TX or BT1120 output interface, with the maximum output of 1080P@60fps, with 1 video layer and 1 UI layer alpha blending

Host Interfaces

  • Transfer rate for AP SPI master up to 80 MHz (10 MB/s max) using the BIF-SPI slave interface
  • Transfer mode for AP eMMC Host up to 8-wire HS200 mode (200 MB/s max) using the BIF-SD device interface
  • BIF-SPI and BIF-SD host interfaces used by AP to access the J2’s DDR, SRAM, and module registers for data exchange and control

Power Management

  • Flexible clock switching, scaling and gating control
  • DVFS support for CPU and BPU
  • BPU0 and BPU1 shutting down respectively.
  • Supports chip-level sleep mode for maximum power saving, only Always-On (AO) power domain active in sleep mode.
  • Supports DDR IO retention in sleep mode, with DRAM in self refresh state

Peripheral Interfaces

  • 4x UART

— 2-wire UART0/2/3

— 4-wire UART1 with hardware flow control

— Baud rate up to 921600 bps

  • 3x SPI

— Master mode only

— Up to 50 MHz

  • 2x I2S

— Supports both master and slave modes

— Half duplex for each, configured as RX or TX

— RX supporting1/2/4/8/16-channel audio input

— TX supporting 1/2-channel audio output

— Supports 8/16/32/48KHz sample rate

— Sample rates of I2S0 and I2S1 can be different

  • 4x I2C, only in master mode, up to 400Kbps
  • 9x PWM
  • 1x QSPI

— Only in master mode

— 1/2/4-wire mode, up to 83 MHz

— Mainly used to connect off-chip SPI NOR/NAND Flash

— Supports XIP mode

  • 2x SD3.0/SDIO3.0/eMMC5.0 Host Controller

— SD0 with 8-bit data bus

— SD1 with 4-bit data bus

— Up to HS200 mode

— Uses SD special IO for 3.3 V/1.8 V power switching

  • 1000 Mbps Ethernet MAC Controller, connected to external PHY chip using the RGMII interface
  • All digital IOs can function as GPIO, and any 4 of them can be selected as interrupt sources or wakeup sources, triggered by positive, negative, or both edges

Others

  • Uses 24 MHz crystal as clock source
  • Uses 32 KHz crystal as RTC clock and low-power clock in sleep mode
  • Embedded 6 PLLs providing clocks for all modules
  • 8 timers
  • Watchdog timer that triggers the entire chip reset in case of system crash
  • RTC timer that keeps running during sleep mode and can act as a wakeup source
  • Embedded 2 kBit EFUSE as chip ID
  • Embedded temperature sensor monitoring chip environment
  • DMAC gathering/scattering data within memories, such as DDR and SRAM
  • 64 KB on-chip SRAM shared by CPU, BIF-SPI, BIF-SD, and DMAC

总结:从以上的介绍中可以看出,J2作为地平线的第一款车规级AI芯片,外围的资源还是比较多的,适合做预警类或AEB等ADAS产品,后续将详细介绍。


本文章是博主花费大量的时间精力进行梳理和总结而成,希望能帮助更多的小伙伴~  🙏🙏🙏

后续内容将持续更新,敬请期待(*^▽^*)

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