ANSYS SIWave SI仿真

 

ANSYS SIwave: Electrothermal Analyses of a PCB - Part I

https://www.youtube.com/watch?v=0-7uRuuFwiY&list=PL0lZXwHtV6OlX1zLLASBnXoW6TZ8W5FrJ

ANSYS How To Videos

7,710次观看 次观看

2016年5月9日发布

 

 

Description

 

For more info: http://bit.ly/2erY0iM This ANSYS video demonstrates how to import the board from ODB++ format into SIwave, and review the layout and schematic of the PCB. ANSYS SIwave is a specialized design platform for power integrity, signal integrity and EMI analysis of electronic packages and PCBs.

 

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[视频]Mentor公司极好的仿真介绍教程视频 | 吴川斌的博客

http://www.mr-wu.cn/start-smarter-with-analysis-tools-for-desktop-pcb-design-webinar/

通过此视频可以了解 PADS 分析工具如何通过设计仿真,识别电路的关键区域。我们将考察如何分析并快速实现信号与 …

 

[SI系列]Ansys SIwave信号完整性分析

https://mp.weixin.qq.com/s?__biz=MzA3NDk5NDgwNg==&mid=2649794452&idx=1&sn=0fe6453bf8aff88bc9a27ae6d396342a&chksm=8773428db004cb9bdc02c26dc54dfae82208fd26d1d4de7bd414c8f3a169b78e8c413b23f779&mpshare=1&scene=23&srcid=1110m2TcGAArdJtPRj1xklR7#rd

 

 

 

 

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S参数仿真步骤

1、导入文件

 

SIwave中文培训手册,详细介绍了SIwave的使用入门基础,包括目录 1 现代 PCB 设计面临的挑战.....................................................................................................1 2 SI/PI 的基本概念,SI/PI 与 EMI 的关系...............................................................................1 2.1 传输线...........................................................................................................................1 2.2 特性阻抗.......................................................................................................................1 2.3 反射系数和信号反射...................................................................................................2 2.4 截止频率.......................................................................................................................3 2.5 S 参数 ...........................................................................................................................3 2.6 电源完整性的定义.......................................................................................................4 2.7 同步开关噪声...............................................................................................................5 2.8 PDS 的阻抗以及目标阻抗的定义...............................................................................5 2.9 去耦电容.......................................................................................................................6 2.10 SI/PI 与 EMI 的关系....................................................................................................7 3 PCB 前仿真——熟悉软件界面和基本操作 ..........................................................................8 3.1 PCB 数据的导入和检查 ..............................................................................................8 3.2 预布局阶段的设计与仿真.........................................................................................13 3.2.1 层叠设计.........................................................................................................13 3.2.2 平面分割.........................................................................................................14 3.2.3 添加去耦电容.................................................................................................14 3.2.4 仿真之前的参数设置.....................................................................................15 3.2.5 谐振分析.........................................................................................................16 4 布线后仿真.............................................................................................................................18 4.1 PI 仿真:....................................................................................................................18 4.1.1 谐振模式分析,退耦电容的作用.................................................................18 4.1.2 阻抗分析,阻抗和谐振的关系.....................................................................20 4.1.3 传导干扰分析和电压噪声测量,及其与谐振的关系.................................22 4.1.4 SSN 仿真(建议初学者跳过本节).............................................................25 4.2 DC Voltage (DCIR) drop 仿真....................................................................................33 4.3 SI 仿真........................................................................................................................38 4.3.1 信号线参数抽取.............................................................................................38 4.3.2 TDR.................................................................................................................41 4.3.3 信号完整性与串扰仿真.................................................................................42 4.3.4 差分信号参数提取和眼图仿真.....................................................................49 4.4 PCB 的 EMI 设计与控制...........................................................................................52 4.4.1 PCB 远场辐射分析 ........................................................................................52 4.4.2 频变源加入(建议初学者跳过本节).
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