IC-基础概念记录ground bound

ground bound：

地弹。指芯片内部“地”电平相对于电路板“地”电平的变化现象。当器件输出端由一个状态跳变到另一个状态时，地弹现象会导致器件逻辑输入端产生毛刺。对于任何形式封装的芯片，其引脚必会存在电感电容等寄生参数，而地弹现象就是由引脚电容引起的。[1]

对于高速高密度电子系统，由于增加的时钟频率和边沿跳变率，以及持续减小的供电电压与电压容限使地弹噪声越来越明显，影响电源和信号的完整性。

ground bound的产生 [3]：

减少ground bound的方法 [3]：

(1)Use low slew outputs unless needed

(2)Do not group SSOs together，break them up

(3)Control number of SSOs through sequencing

(4)For some families, programming "unused" outputs will improve grounding or supply for outpur stages.

(5)Use buffers, particularly for large memory arrays or long lines

(6)Avoid sockets

(7)For spare pad locations, pre-wire power, ground, and bypass capacitor connections

(8)For SSI/MSI, center ground pins

(9)Choose input thresholds wisely

(10)Keep clocks physically away from pins that can couse ground bounce

(11)Keep clocks close to ground pins

 

[1]地弹_百度百科 https://baike.baidu.com/item/%E5%9C%B0%E5%BC%B9/5356579?fr=aladdin

[2]信号完整性研究系列--什么是地弹 - Marvin_wu - CSDN博客 https://blog.csdn.net/wu20093346/article/details/38658157

[3]https://wenku.baidu.com/view/0b9e4a6fb84ae45c3b358c8f.html