Chapter 3 The Metal Layers

Chapter 3 The Metal Layers

Passivation layer: 在芯片顶端第一层的insulator

Overglass layer: 在insulator上的开窗, 也喜欢叫PAD

Capacitance of Metal-to-Substrate:

$$
C_{pad->sub}=areaC_{plate}+perimeterC_{fringe}
$$

金属上留过大电流会造成electromigration (metal physically moves) 这也是为什么做PMIC需要做EM仿真检查, Check Javg and Jmax, 确保不会烧毁

Contact or Via

Via: 电阻 Estimate 10ohm/contact. 电流: no more than 100uA of current flow per via

最后介绍了MIM and MOM金属层电容

MIM capacitor (Metal-Insulator-Metal): 电容值小, 而且金属-衬底的寄生电容较大

MOM capacitor (Metal-Oxide-Metal): 电容值更大一些, 目前在先进工艺更常用