晶圆减薄机_进口半导体材料设备wafer grinding

最新推荐文章于 2025-03-04 14:07:56 发布

衡鹏企业

最新推荐文章于 2025-03-04 14:07:56 发布

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晶圆减薄机是一款全自动连续下进给研磨机，配备双抛光站，能显著提高生产效率。通过6轴机器人处理晶圆，加载/卸载手臂设计适用于25um的处理能力。对于薄晶圆，建议使用边缘修剪系统以减少边缘破损。研磨速度、砂轮和研磨主轴下降速率可调整以控制生产率、表面光洁度和砂轮寿命。双点在线测量系统控制研磨主轴1和2下的晶圆厚度，推荐使用激光检测以实现更高精度的厚度控制（针对<50um）。可编程振荡抛光头可以与电机驱动的主轴角度调整配合使用，以保持晶圆轮廓（ttv）。研磨和抛光完成后，机器人会自动将晶圆转移到安装单元进行UV曝光、退带和安装。可选配预切割DAF功能，单DAF功能已包含。系统集成硬币堆叠功能，本地抛光单元可去除亚表面损伤，增强晶圆晶粒强度，能处理25微米的最终厚度。

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Wafer grinder is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for thin wafers. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2 with an optional laser detection for a more precision thickness accuracy (recommended for < 50 um). Programmable oscillating polish heads can be programmed to maintain wafer profile (ttv) in conjunction with with the optional motorized spindle angle adjustment. After completion at grind and polish, wafer is automatically transferred by robot to the mounter unit for UV exposure, detape, and mount. Pre-cut DAF feat

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