Thermal

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分类专栏：可靠性验证(ReliabilityVerification) 文章标签： Thermal 热设计

于 2014-09-26 14:17:30 首次发布

本文链接：https://blog.csdn.net/impossible1224/article/details/39525797

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1. 几个概念

1、结温（Tj），指的是IC的结点（junction）的温度，一般来说最高温度为125℃，由晶体硅工艺决定。非常值得注意的是，这里所说的125℃其实更多的指的是芯片正常工作时的温度（如Timing约束等），但是，即使超过125℃，如135℃，一般芯片也不会有损伤的。

2、环温（Ta），指的是环境（ambient）的温度。

3、壳温（Tc），指的是IC表面外壳（case）的温度。

4、功耗（PD），耗散功率，单位是W。

5、热阻（Rθ），温升除以PD，单位是℃/W。

6、热阻θJA，The intent of θJA measurements is solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a package in an application-specific environment.

JESD51-2明确说，θJA只是用来对比封装性能，不应该也不能用来估算结温。但是，实际上利用θJA来计算结温在某些情况下还是可取的（下文1.2.1小节例子）。

1.1 Psi（ψ）和Theta（θ）的区别

ψ：The temperature difference between point X to point Y if the total heat is known. The heat flowing along the specific path point X to point Y is NOT known.
-- This parameter typically serves for estimation of Junction temperature (TJ) at known total dissipated power (PD) inside the package when a temperature is measured at package perimeter (Lead, Exposed Pad, Board, etc.)

-- 热特征参数ψ指的是不确定热传播路径的情况，ψjt经常用来计算结温（和PCB强相关）。
θ：The amount of heat that flows from point X to point Y if the temperatures at X and Y points are known (connected by the thermal resistance). The path the heat flows is known and it is completely determined by the resistance.

-- 热阻θ指的是确定re传播路径的情况，θja经常用来计算结温，而θjc是不能用来计算结温的（结果会偏大非常多）。

1.2、测试ψ和θ的方法

1.2.1、θJA测量方法：JESD51-2A

芯片厂商一般会要求封装厂仿真得到热阻和热特征参数（环温：85℃），封装厂可以根据JEDEC标准的Test Board（如2s2p PCB板子）或者芯片厂商指定的PCB进行仿真；另外还可以决定是否需要加上散热片进行仿真。

当封装厂直接采用芯片厂商提供的评估板PCB进行热仿真的话，芯片厂商是可以利用θJA来估算结温的。

1.2.2、θJC测量方法：JESD51-14

θJC在仿真或实验的时候，必须保证芯片的Case由温度固定不变的散热片导热（这也就是为什么实际情况下θJC无法用来估算结温的原因）。

2.计算结温的方法

2.1.没有散热片Heat Sink的情形

没有散热片的时候，应该利用ψjt来计算结温：

2.2.有散热片Heat Sink的情形

Ψjt should not be used when application of a heat sink is intended. Instead, following equation should be used.

2.3.几种错误的计算方式

2.3.1.通过θja计算结温

Tj = Ta + θja*Power

TI文档：This is a misapplication of the RθJA thermal parameter because RθJA is a variable function of not just the package, but of many other system level characteristics such as the design and layout of the printed circuit board (PCB) on which the part is mounted. In effect, the test board is a heat sink that is soldered to the leads of the device. Changing the design or configuration of the test board changes the efficiency of the heat sink and therefore the measured RθJA. In fact, in still-air JEDEC-defined RθJA measurements, almost 70%–95% of the power generated by the chip is dissipated from the test board, not from the surfaces of the package. Because a system board rarely approximates the test coupon used to determine RθJA, application of RθJA using Equation 1 results in extremely erroneous values.

尽管TI文档上说，利用θJA来计算结温的时候会因为PCB等因素的影响而不准确，但是，只要PCB等因素差不多，还是可以利用该热阻来估算结温的，并非完全不可取。

2.3.2.通过θjc计算结温

Tj = Tc + θjc*Power

TI文档：The fallacy here is that only a very small percentage of heat energy in a typical plastic package is convected and radiated off the top surface of the package. Many models have shown 60%-95% of thermal energy from a chip is actually convected and radiated off the PCB to which the package is attached. If one assumes the entire power is dissipated by the top surface, the junction temperature calculated by Equation 4 is higher than reality.