MOS SPICE models

Level 1 SPICE Models for NMOS

0.5 μm工艺经典值

LEVEL = 1VTO = 0.7GAMMA = 0.45PHI = 0.9
NSUB = 9e+14LD = 0.08e-6UO = 350LAMBDA = 0.1
TOX = 9e-9PB = 0.9CJ = 0.56e-3CJSW = 0.35e-11
MJ = 0.45MJSW = 0.2CGDO = 0.4e-9JS = 1.0e-8

Level 1 SPICE Models for PMOS

0.5 μm工艺经典值

LEVEL = 1VTO = 0.8GAMMA = 0.4PHI = 0.8
NSUB = 5e+14LD = 0.09e-6UO = 100LAMBDA = 0.2
TOX = 9e-9PB = 0.9CJ = 0.94e-3CJSW = 0.32e-11
MJ = 0.5MJSW = 0.3CGDO = 0.3e-9JS = 0.5e-8

参数解释

  • LEVEL:因为是最简单的MOS SPICE model,所以【Level 1】
  • VTO:threshold voltage with zero V_{SB}.(unit: V)。i.e. 衬底电压为0时的阈值电压V_{TH}
  • GAMMA: body effect coefficient.(unit: V^{\frac{1}{2}}). i.e. 体效应系数\gamma,可以引起阈值电压改变.经典值在0.3~0.4V

  • PHI: 2\phi_F(unit: V).
  • TOX: gate oxide thickness (unit: m)。
  • NSUB: substrate doping (unit: cm^{-3}). i.e. 衬底掺杂

  • LD: source / drain side diffusion (unit: m). i.e. 源极和漏极在工艺制作过程中造成扩散,使有效沟道长度不等于理论的沟道长度。L_{eff}=L-2 LD
  • UO: channel mobility (unit: cm^2/V/s). i.e. NMOS是电子迁移率,PMOS是空穴迁移率。电子迁移率一般大于空穴迁移率,空穴迁移率大约为电子迁移率的 25%。

  • LAMBDA: channel-length modulation coefficient (unit: V^{-1}). i.e. 沟道长度调制效应系数,会引起源漏电流I_D的变化,和特征电阻的变化r_o=\frac{1}{\lambda I_D}
  • CJ: source / drain bottom-plate junction capacitance per unit area (unit: F/m^2)。 i.e. I_D=\frac{1}{2}\mu _nC_{ox}\frac{W}{L}(V_{GS}-V_{TH})^2中的C_{ox}

  • CJSW: source / drain sidewall junction capacitance per unit length (unit: F/m)
  • PB: source / drain junction built-in potential (unit: V)
  • MJ: exponent in CJ equation (unitless)

  • MJSW: exponent in CJSW equation (unitless)
  • CGDO: gate-drain overlap capactiance per unit width (unit: F/M)
  • CGSO: gate-source overlap capacitance per unit width (unit: F/m)
  • JS: source / drain leakage current per unit area (unit: A/m^2)
### MOSFET Corner Parameters or Models in Semiconductor Design In semiconductor design, MOSFET corner parameters refer to variations in device characteristics that occur due to process fluctuations during manufacturing. These corners represent extreme points within the statistical distribution of these variations and are used to ensure circuit performance across all possible conditions. The typical corner models include: - **TT (Typical-Typical)**: Represents nominal values where both nMOS and pMOS transistors behave as expected under standard operating conditions. - **SS (Slow-Slow)**: Both types of devices exhibit slower than normal behavior; this condition simulates a scenario with lower mobility and higher threshold voltages. - **FF (Fast-Fast)**: Devices operate faster than usual, characterized by increased current drive capability but possibly at the expense of leakage currents. - **SF (Slow-Fast)** / **FS (Fast-Slow)**: One type operates slowly while another runs quickly, which helps assess asymmetrical effects between NMOS and PMOS components[^1]. For accurate simulation and analysis, designers often use SPICE model files provided by foundries. These contain detailed information about how each parameter changes over temperature, voltage, and geometry scaling factors specific to different technology nodes. Additionally, advanced compact models like BSIM series incorporate more sophisticated physics-based equations capturing short-channel effects, body biasing influences, etc., thereby providing better accuracy especially for deep-submicron processes[^2]. To effectively manage thermal issues associated with exposed package designs involving power MOSFETs, guidelines such as those outlined in AN-1520 offer valuable insights into optimal board layout practices aimed at minimizing junction-to-case resistance [^3]. This ensures efficient heat dissipation from high-power switching elements without compromising electrical integrity or reliability. ```python # Example Python code snippet demonstrating usage of corner parameters in simulations corners = ['tt', 'ss', 'ff', 'sf'] for corner in corners: simulate_mosfet_performance(corner=corner) ```
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